Handbook of Silicon Wafer Cleaning Technology

2nd Edition

Print ISBN: 9781493303434
eBook ISBN: 9780815517733
Imprint: William Andrew
Published Date: 10th January 2008
Page Count: 660
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The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included.

Table of Contents

Part 1: Introduction and Overview

  1. Overview and Evolution of Silicon Wafer Cleaning Technology
  2. Overview of Wafer Contamination and Defectivity Part 2: Wet-Chemical Processes
  3. Particle Deposition and Adhesion
  4. Aqueous Cleaning and Surface Conditioning Processes Part 3: Dry Cleaning Processes
  5. Gas-phase Wafer Cleaning Technology
  6. Plasma Stripping and Cleaning
  7. Cryogenic Aerosols and Supercritical Fluid Cleaning Part 4: Analytical and Control Aspects
  8. Detection and Measurement of Particulate Contaminants
  9. Surface Chemical Composition and Morphology
  10. Ultratrace Impurity and Surface Morphology Analysis
  11. Analysis and Control of Electrically Active Contaminants Part 5: Directions for the Near Future


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© William Andrew 2008
William Andrew
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