Handbook of Silicon Based MEMS Materials and Technologies

PART I: Silicon as MEMS Material
Edited by Markku Tilli
1. Properties of silicon
2. CZ Growth of silicon crystals
3. Properties of silicon crystals
4. Oxygen in Silicon
5. Silicon wafers; preparation and properties
6. Epi wafers; preparation and properties
7. Thick-Film SOI wafers; preparation and properties
8. Silicon dioxides

PART II: Modeling in MEMS
Edited by Teruaki Motooka and Risto Nieminen
9. Multiscale modeling methods
10. Manufacture and processing of MEMS structures
11. Mechanical properties of silicon microstructures
12. Electrostatic and RF properties of MEMS structures
13. Optical Modelling of MEMS
14. Gas Damping in Vibrating MEMS structures

PART III: Measuring MEMS
Edited by Veli-Matti Airaksinen
15. Introduction to Measuring MEMS
16. Silicon wafer and thin film measurements
17. Optical measurement of static and dynamic displacement
18. MEMS residual stress characterization, methodology and perspective
19. Strength of bonded interfaces
20. Focused ion and electron beam techniques
21.Oxygen and Bulk Microdefects in Silicon

PART IV: Micromachining Technologies in MEMS
Edited by Helmut Seidel
22. MEMS litography
23. Deep reactive ion etching (DRIE)
24. Wet etching of silicon
25. Porous silicon based MEMS
26. Atomic layer deposition in MEMS technology
27. Metallic glass
29. Surface micromachining
29. Silicon based bioMEMS micromachining technologies

PART V: Encapsulation of MEMS Components
Edited by Heikki Kuisma and Ari Lehto
30. Introduction to encapsulation of MEMS devices
31. Silicon direct bonding
32. Anodic bonding
33. Glass frit bonding
34. Metallic alloy seal bonding
35. Bonding CMOS processed wafers
36. Non-Destructive Bond Strength Testing of Anodic Bonded Wafers
37. Wafer Bonding Equipment
38. Encapsulation by Film Deposition
39. Via Technologies for MEMS
40. Outgassing and Gettering
41. Dicing of MEMS devices
42. Hermecity Tests

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.

Key topics covered include:

• Silicon as MEMS material
• Material properties and measurement techniques
• Analytical methods used in materials characterization
• Modeling in MEMS
• Measuring MEMS
• Micromachining technologies in MEMS
• Encapsulation of MEMS components
• Emerging process technologies, including ALD and porous silicon

Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.

• Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.
• Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
• Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
• Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.

• Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
• Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
• Discusses properties, preparation, and growth of silicon crystals and wafers
• Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Engineers, researchers and scientists in sensor manufacturing