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This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.
Coatings manufacturers and processors for the electronics industry.
- Chemistry and Properties of Coatings - Polyurethanes-Epoxies-Phenoxies-Silicones
2. Chemistry and Properties of Coatings - Polyimides-Fluorocarbons-Polyxylylenes
3. Chemistry and Properties of Coatings - Polyesters-Polyvinyls-Polystyrenes-Acrylics-Diallylphthalates-Polyamides-Phenolics-Polysulfides
Diallylphthalate and Other Allylic Polymers
4. Functions of Coatings
5. Manufacturing Technology
Curing and Polymerization of Solid Films
General Properties of Thin-Film Polymer Coatings
6. Circuit Coatings
Coatings for Thin- and Thick-Film Circuits
7. Coatings for Space Electronics
Space and Nuclear Radiation
8. Wire and Coil Coatings
Application and Winding Methods
Testing Wire Coatings
Effects of Radiation
Stripping of Wire Coatings
9. Coating for Electronic Components and Devices
Functions of Plastic Packaging Materials for Discrete Devices
Plastic Packaging Materials
Functions of Coating Materials for Hybrid Microcircuits
Parameters Affecting Electronic Devices
Commercial and Military Uses of Plastic Packages
Commercial, Military, and Federal Specifications
Test Methods for Organic Coatings
Table A-1: Abbreviations and Symbols Used in Text
Table A-2: Thickness Units and Equivalents Commonly Used for Coatings
Table A-3: Thermal-Conductivity Units and Equivalents
Table A-4: Thermal-Conductivity Data
Table A-5: Coefficients of Linear Thermal Expansion
Table A-6: Water-Absorption Data
Table A-7: Moisture-Vapor-Transmission Rates of Plastic Coatings and Films
Table A-8: Sward Hardness Values for Coatings
Table A-9: Abrasion-Resistance Values for Organic Coatings
Table A-10: Dielectric Strength
Table A-11: Arc Resistance
Table A-12: Volume Resistivities
Table A-13: Dielectric Constants of Polymer Coatings (at 25¦C)
Table A-14: Dielectric Constants of Materials Other Than Polymers
Table A-15: Dielectric Constants of Inorganic Insulators
Table A-16: Dissipation Factors (at 25¦C)
- No. of pages:
- © William Andrew 1990
- 31st December 1990
- William Andrew
- Hardcover ISBN:
- eBook ISBN:
has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes.
Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)
AvanTeco, Whittier, CA, USA
Southern Oregon University
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