Handbook of Plasma Processing Technology

1st Edition

Fundamental, Etching, Deposition and Surface Interactions



This is a comprehensive overview of the technology of plasma-based processing, written by an outstanding group of 29 contributors.


Scientists, engineers, graduate students in the fields of semiconductors, thin films, energy, environment, automotive, medical and food packaging.

Table of Contents

1. Techniques for IC Processing David B. Fraser and William D. Westwood 1.1 Introduction 1.2 Plasma Processing in Microelectronics 1.3 Summary 2. Introduction to Plasma Concepts and Discharge Configurations Joseph L. Cecci 2.1 Introduction 2.2 Fundamental Plasma Discharge Concepts 2.3 Electron Heating and Energy Distribution 2.4 Breakdown 2.5 Glow Discharges 2.6 References 3. Fundamentals of Sputtering and Reflection David N. Ruzic 3.1 Introduction 3.2 Modeling 3.3 Experimental Yields 3.4 Exceptions 3.5 References 4. Bombardment-Induced Compositional Changes with Alloys, Oxides, Oxysalts, and Halides Roger Kelly 4.1 Introduction 4.2 The Role of the Surface Binding Energy 4.3 The Role of Segregation 4.4 The Role of Bombardment Induced Decomposition 4.5 Overview 4.6 References 5. RF Diode Sputter Etching and Deposition Joseph S. Logan 5.1 Introduction 5.2 RF Discharges 5.3 Equipment 5.4 RF Sputter-Deposition 5.5 Sputter Etching Applications 5.6 Practical Matters 5.7 References 6. Magnetron Plasma Deposition Processes Stephen M. Rossnagel 6.1 Introduction 6.2 Experiments 6.3 Summary 6.4 References 7. Broad-Beam Ion Source Harold R. Kaufman and Raymond S. Robinson 7.1 Introduction 7.2 Gridded Ion Sources 7.3 Gridless Ion Sources 7.4 Concluding Remarks 7.5 References 8. Reactive Ion Etching Gottlieb S. Oehrlein<


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© 1990
William Andrew
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"The text provides and excellent reference for plasma processing." - SAMPE Journal