Most design engineers are tasked to design against failure, and one of the biggest causes of product failure is failure of the material due to fatigue/fracture. From leading experts in fracture mechanics, this new text provides new approaches and new applications to advance the understanding of crack initiation and propagation. With applications in composite materials, layered structures, and microelectronic packaging, among others, this timely coverage is an important resource for anyone studying or applying concepts of fracture mechanics.

Key Features

  • Concise and easily understood mathematical treatment of crack tip fields (chapter 3) provides the basis for applying fracture mechanics in solving practical problems
  • Unique coverage of bi-material interfacial cracks (chapter 8), with applications to commercially important areas of composite materials, layered structures, and microelectronic packaging
  • A full chapter (chapter 9) on the cohesive zone model approach, which has been extensively used in recent years to simulate crack propagation
  • A unified discussion of fracture criteria involving nonlinear/plastic deformations


Graduate students and researchers studying mechanics. Appropriate for Mechanical, Aerospace, Civil, and Biomedical Engineers in the field of mechanics


No. of pages:
© 2012
Academic Press
Print ISBN:
Electronic ISBN:

About the author

Chin-Teh Sun

Neil A. Armstrong Distinguished Professor of Aeronautics and Astronautics Ph.D., Northwestern University 1967 Awards and Major Appointments AIAA Fellow ASME Fellow ASC Fellow Research Award for excellence in faculty research, Schools of Engineering, Purdue University, 2004. ASTM Committee D-30 Wayne W. Stinchcomb Memorial Award Research Areas Current research interests include the following areas: Composite Materials and Structures Fractures Mechanics Smart Materials – Nanomaterials

Affiliations and Expertise

Neil A. Armstrong Distinguished Professor of Aeronautics and Astronautics Purdue University