Electroless Copper and Nickel-Phosphorus Plating

1st Edition

Processing, Characterisation and Modelling

Authors: W Sha Xiaomin Wu K G Keong
Hardcover ISBN: 9781845698089
eBook ISBN: 9780857090966
Imprint: Woodhead Publishing
Published Date: 1st January 2011
Page Count: 304
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Table of Contents

Author contact details

Preface

Acknowledgements

Chapter 1: Introduction to electroless copper and nickel–phosphorus (Ni–P) depositions

Abstract:

1.1 Electroless copper deposition

1.2 Electroless nickel–phosphorus (Ni–P) deposition

1.3 How to plate the depositions in the laboratory

1.4 Research objectives

1.5 Structure of the book

Part I: Electroless copper depositions

Chapter 2: Surface morphology evolution of electroless copper deposits

Abstract:

2.1 Introduction and surface morphology of the substrate

2.2 Formaldehyde high temperature solution deposits

2.3 Glyoxylic acid high temperature solution deposits

2.4 Formaldehyde high concentration low temperature (FHCLT) solution deposit

2.5 Formaldehyde low concentration low temperature (FLCLT) solution deposit

2.6 Glyoxylic acid high concentration low temperature (GHCLT) solution deposit

2.7 Glyoxylic acid low concentration low temperature (GLCLT) solution deposit

2.8 Electroplated and electroless copper deposits

2.9 Conclusions

Chapter 3: Cross-section of electroless copper deposits and the void fraction

Abstract:

3.1 Calculating the void fraction on an electron microscopy cross-section image

3.2 Determination of the optimum threshold values of grey scale and noise

3.3 The voids

3.4 Conclusions

Chapter 4: Crystal structure and surface residual stress of electroless copper deposits

Abstract:

4.1 X-ray normal scan patterns and the crystal structures of the deposits

4.2 Tilted scan patterns and the surface residual stress of the electroless copper

4.3 The error in calculating the position and the relative intensities of the peaks

4.4 The error in linear regression for surface residual stress analysis

4.5 Conclusions

Chapter 5: The atomic model


Description

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.

After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.

Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

Key Features

  • Written by leading experts in the field, this important book reviews the deposition process and the key properties of electroless copper and nickel-phosphorus deposits as well as their practical applications
  • Chapters review areas such as surface morphology and residual stress, modelling surface structure, crystallisation of nickel-phosphorus deposits and hardness evolution
  • An invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries

Readership

Researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics, and aerospace industries


Details

No. of pages:
304
Language:
English
Copyright:
© Woodhead Publishing 2011
Published:
Imprint:
Woodhead Publishing
eBook ISBN:
9780857090966
Hardcover ISBN:
9781845698089
Paperback ISBN:
9780081014974

Reviews

The author's use of modelling brings a new level of fundamental understanding to the field., Materials World


About the Authors

W Sha Author

Professor Wei Sha is Professor of Materials Science at The Queen’s University of Belfast, UK

Affiliations and Expertise

Materials science; Metallurgy: Queen’s University Belfast

Xiaomin Wu Author

Affiliations and Expertise

Materials innovation institute, Delft, The Netherlands

K G Keong Author

Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.

Affiliations and Expertise

formerly Queen's University Belfast, UK