Compatibility and Testing of Electronic Components - 1st Edition - ISBN: 9780408703536, 9781483103358

Compatibility and Testing of Electronic Components

1st Edition

Authors: C. E. Jowett
eBook ISBN: 9781483103358
Imprint: Butterworth-Heinemann
Published Date: 1st January 1972
Page Count: 354
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Compatibility and Testing of Electronic Components outlines the concepts of component part life according to thresholds of failure; the advantages that result from identifying such thresholds; their identification; and the various tests used in their detection. The book covers topics such as the interconnection of miniature passive components; the integrated circuit compatibility and its components; the semiconductor joining techniques; and the thin film hybrid approach in integrated circuits. Also covered are topics such as thick film resistors, conductors, and insulators; thin inlays for electronic applications; and humidity corrosion of metallic resistors. The text is recommended for electrical engineers who would like to know more about electrical components, especially those who are interested in the fields of thin films and integrated circuitry.

Table of Contents


1 Introduction

2 Integrated Circuit Compatibility

3 Survey of Semiconductor Joining Techniques

4 Commercial Application of Thick Film Hybrids

5 Thin Film Hybrid Approach to Integrated Circuits

6 Factors Affecting Thick Film Devices

7 Adhesion of Platinum-Gold Glaze Conductors

8 Thin Inlays for Electronic Applications

9 Humidity Corrosion of MetalUc Resistors

10 The Interface Between Glaze Resistors

11 Confusion in Multilayer Systems

12 Dielectric Formulations for Screened Ceramic Microcircuit Substrates

13 Failure Modes in Thin Film Circuits

14 Specifying Resistance Temperature Stability

15 Poly-Para-Xylylene in Thin Film Applications

16 Thin Film A1-A12O3-A1 Capacitors

17 Compatible Fabrication of Tantalum Thin Film Integrated Circuits

18 Silicon Oxide Micromodule Capacitors

19 Chip Capacitors in Hybrid Microelectronics

20 Design Construction and Testing of Miniature Relays

21 Compatibility of Flexible Film Wiring

22 The Purpose of Testing

23 Reliability Screening Using Infrared Radiation

24 Environmental and Life Testing of Magnetic Components

25 Searching for Incompatibility in Integrated Circuits

26 Encapsulated Component Stress Testing



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© Butterworth-Heinemann 1972
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C. E. Jowett

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