Table of Contents

1. Functions and Requirements of Coatings for Electronic Applications 1.1 Functions and Requirements 1.2 Environmental Protection Functions 1.3 Special Metal Protection 1.4 Electrical Functions 1.5 Thermal Functions 2. Chemistry and Properties of Polymer Coatings 2.1 Acrylics 2.2 Polyesters 2.3 Polyvinyls 2.4 Polystyrenes 2.5 Diallylphthalate and Other Allylic Polymers 2.6 Epoxies 2.7 Polyurethanes 2.8 Silicones 2.9 Polyimides 2.10 P-Polyxylylenes 2.11 Benzocyclobutene, Cyclotene 2.12 Fluorocarbons and Fluorinated Polymers 2.13 Polysulfones 2.14 Polyaryletheretherketone (PEEK) 2.15 Polyamides 2.16 Phenolics 2.17 Polysulfides 3. Manufacturing Technology 3.1 Masking 3.2 Cleaning 3.3 Surface Preparation 3.4 Coating Preparation 3.5 Application Methods 3.6 Curing and Polymerization Processes 3.7 Manufacturing Issues 4. Applications 4.1 Conformal Coatings for Printed Wiring Assemblies (PWA) 4.2 Coatings for Semiconductor Single Chip and Multichip Modules 4.3 Coatings for Discrete Passive Devices 4.4 Multilayer Circuit Board Fabrication 4.5 Interlayer Dielectric Coatings for Multichip Module Substrates 4.6 Polymer Waveguides 4.7 Solder Maskants 4.8 Chip-Scale and Ball Grid Array Packages 4.9 Chip-on-Board and Glob-Top Coatings 4.10 Particle Immobilizing Coatings and Particle Getters 4.11 Reinforcement of Interconnections 4.12 Wire

Details

No. of pages:
545
Language:
English
Copyright:
© 2003
Published:
Imprint:
William Andrew
Print ISBN:
9780815514923
Electronic ISBN:
9780080947044

About the editors

James J. Licari

has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes. Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)

Affiliations and Expertise

AvanTeco, Whittier, CA, USA

James J. Licari

has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes. Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)

Affiliations and Expertise

AvanTeco, Whittier, CA, USA

Reviews

"There are not many books available on coatings for electronic assemblies ...each of the sections did explain the coating process in detail and the benefits of each system." - Bob Willis, Process Engineering Consultant Electronic Presentation Services