Ceramic Thick Films for MEMS and Microdevices - 1st Edition - ISBN: 9781437778175, 9781437778182

Ceramic Thick Films for MEMS and Microdevices

1st Edition

Authors: Robert A. Dorey
Hardcover ISBN: 9781437778175
eBook ISBN: 9781437778182
Imprint: William Andrew
Published Date: 21st October 2011
Page Count: 192
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Table of Contents

  • Preface
  • Acknowledgments
  • Introduction
  • Chapter 1. Integration and devices
    • 1.1. Introduction
    • 1.2. Structure of Film Devices
    • 1.3. Obstacles to Integration
    • 1.4. Overcoming Challenges
    • 1.5. Overview of Functional Devices
  • Chapter 2. Routes to thick films
    • 2.1. Introduction
    • 2.2. Routes to Achieve Non-thick–Thick Films
    • 2.3. Thick-film Powder-based Routes
    • 2.4. Modified Powder Routes
    • 2.5. Powder Manufacturing Routes
    • 2.6. Milling
  • Chapter 3. Thick-film deposition techniques
    • 3.1. Introduction
    • 3.2. Creating Stable Inks
    • 3.3. Components of Inks
    • 3.4. Directed Coating Techniques
    • 3.5. Spreading Coating Techniques
    • 3.6. Immersion Coating Techniques
    • 3.7. Post-production Poling
    • 3.8. Help! It has All Gone Wrong
  • Chapter 4. Microstructure–property relationships
    • 4.1. Introduction
    • 4.2. Material Properties
    • 4.3. Why are Film Properties not the Same as Bulk Properties?
    • 4.4. Microstructural Variations
    • 4.5. Functional Properties
    • 4.6. Mechanical Properties
    • 4.7. Cracking
    • 4.8. Interrelationship Between Property–Microstructure Relationships
  • Chapter 5. Patterning
    • 5.1. Introduction
    • 5.2. Subtractive Patterning
    • 5.3. Additive Patterning
    • 5.4. Capabilities and Limitations of Patterning
  • Chapter 6. Houston, we have a problem
    • 6.1. Introduction
    • 6.2. Integration
    • 6.3. Cracking and Surface Finish
    • 6.4. Poor Properties
    • 6.5. Patterning
  • Chapter 7. Recipes
    • 7.1. Powders
    • 7.2. Sols
    • 7.3. Films and Inks
    • 7.4. Processing, Poling, and Useful Stuff!
  • Bibliography
  • Index

Description

  • Preface
  • Acknowledgments
  • Introduction
  • Chapter 1. Integration and devices
    • 1.1. Introduction
    • 1.2. Structure of Film Devices
    • 1.3. Obstacles to Integration
    • 1.4. Overcoming Challenges
    • 1.5. Overview of Functional Devices
  • Chapter 2. Routes to thick films
    • 2.1. Introduction
    • 2.2. Routes to Achieve Non-thick–Thick Films
    • 2.3. Thick-film Powder-based Routes
    • 2.4. Modified Powder Routes
    • 2.5. Powder Manufacturing Routes
    • 2.6. Milling
  • Chapter 3. Thick-film deposition techniques
    • 3.1. Introduction
    • 3.2. Creating Stable Inks
    • 3.3. Components of Inks
    • 3.4. Directed Coating Techniques
    • 3.5. Spreading Coating Techniques
    • 3.6. Immersion Coating Techniques
    • 3.7. Post-production Poling
    • 3.8. Help! It has All Gone Wrong
  • Chapter 4. Microstructure–property relationships
    • 4.1. Introduction
    • 4.2. Material Properties
    • 4.3. Why are Film Properties not the Same as Bulk Properties?
    • 4.4. Microstructural Variations
    • 4.5. Functional Properties
    • 4.6. Mechanical Properties
    • 4.7. Cracking
    • 4.8. Interrelationship Between Property–Microstructure Relationships
  • Chapter 5. Patterning
    • 5.1. Introduction
    • 5.2. Subtractive Patterning
    • 5.3. Additive Patterning
    • 5.4. Capabilities and Limitations of Patterning
  • Chapter 6. Houston, we have a problem
    • 6.1. Introduction
    • 6.2. Integration
    • 6.3. Cracking and Surface Finish
    • 6.4. Poor Properties
    • 6.5. Patterning
  • Chapter 7. Recipes
    • 7.1. Powders
    • 7.2. Sols
    • 7.3. Films and Inks
    • 7.4. Processing, Poling, and Useful Stuff!
  • Bibliography
  • Index

Key Features

  • Provides detailed guidance on the fabrication techniques and applications of thick film MEMS, for engineers and R&D groups
  • Written by a single author, this book provides a clear, coherently written guide to this important emerging technology
  • Covers materials, fabrication and applications in one book

Readership

Engineers working in the semiconductor / MEMS industry – in design, manufacturing and R&D functions; Engineers in industry sectors using MEMS devices, from automotive / aerospace to biosensors / medicine; Researchers and graduate students in academic institutions.


Details

No. of pages:
192
Language:
English
Copyright:
© William Andrew 2011
Published:
Imprint:
William Andrew
eBook ISBN:
9781437778182
Hardcover ISBN:
9781437778175
Paperback ISBN:
9780128103579

About the Authors

Robert A. Dorey Author

Dr. Robert Dorey is a Royal Academy of Engineering/EPSRC Research Fellow, Senior Lecturer in Micro a

Affiliations and Expertise

Cranfield University, UK