Secure CheckoutPersonal information is secured with SSL technology.
Free ShippingFree global shipping
No minimum order.
- Chapter 1. Integration and devices
- 1.1. Introduction
- 1.2. Structure of Film Devices
- 1.3. Obstacles to Integration
- 1.4. Overcoming Challenges
- 1.5. Overview of Functional Devices
- Chapter 2. Routes to thick films
- 2.1. Introduction
- 2.2. Routes to Achieve Non-thick–Thick Films
- 2.3. Thick-film Powder-based Routes
- 2.4. Modified Powder Routes
- 2.5. Powder Manufacturing Routes
- 2.6. Milling
- Chapter 3. Thick-film deposition techniques
- 3.1. Introduction
- 3.2. Creating Stable Inks
- 3.3. Components of Inks
- 3.4. Directed Coating Techniques
- 3.5. Spreading Coating Techniques
- 3.6. Immersion Coating Techniques
- 3.7. Post-production Poling
- 3.8. Help! It has All Gone Wrong
- Chapter 4. Microstructure–property relationships
- 4.1. Introduction
- 4.2. Material Properties
- 4.3. Why are Film Properties not the Same as Bulk Properties?
- 4.4. Microstructural Variations
- 4.5. Functional Properties
- 4.6. Mechanical Properties
- 4.7. Cracking
- 4.8. Interrelationship Between Property–Microstructure Relationships
- Chapter 5. Patterning
- 5.1. Introduction
- 5.2. Subtractive Patterning
- 5.3. Additive Patterning
- 5.4. Capabilities and Limitations of Patterning
- Chapter 6. Houston, we have a problem
- 6.1. Introduction
- 6.2. Integration
- 6.3. Cracking and Surface Finish
- 6.4. Poor Properties
- 6.5. Patterning
- Chapter 7. Recipes
- 7.1. Powders
- 7.2. Sols
- 7.3. Films and Inks
- 7.4. Processing, Poling, and Useful Stuff!
The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications – forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.
- Provides detailed guidance on the fabrication techniques and applications of thick film MEMS, for engineers and R&D groups
- Written by a single author, this book provides a clear, coherently written guide to this important emerging technology
- Covers materials, fabrication and applications in one book
Engineers working in the semiconductor / MEMS industry – in design, manufacturing and R&D functions; Engineers in industry sectors using MEMS devices, from automotive / aerospace to biosensors / medicine; Researchers and graduate students in academic institutions.
- No. of pages:
- © William Andrew 2011
- 26th September 2011
- William Andrew
- Hardcover ISBN:
- eBook ISBN:
- Paperback ISBN:
Dr. Robert Dorey is a Royal Academy of Engineering/EPSRC Research Fellow, Senior Lecturer in Micro a
Cranfield University, UK
Elsevier.com visitor survey
We are always looking for ways to improve customer experience on Elsevier.com.
We would like to ask you for a moment of your time to fill in a short questionnaire, at the end of your visit.
If you decide to participate, a new browser tab will open so you can complete the survey after you have completed your visit to this website.
Thanks in advance for your time.