Series: Materials and Processes for Electronic Applications

Most recent volume

Volume . Coating Materials for Electronic Applications

Published: 1st January 2030

This book provides the answers to those questions vital to the successful design and manufacturing of electronic components, modules, and systems such as:

• How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments?
• What coating types can be used to protect microelectronics in military, space, automotive, or medical environments?
• How can the chemistry of polymers be correlated to desirable physical and electrical properties?
• How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outgassing?
• What are the best processes that manufacturing can use to mask, clean, prepare the surface, dispense the coating, and cure the coating?
• What quality assurance and in-process tests can be used to assure reliability?
• What government or industry specifications are available?
• How can organic coatings be selected to meet OSHA, EPA, and other regulations?

Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits.

Materials engineers and chemists will benefit greatly from coverage of chemistry and properties of the main types of polymer coatings including: Epoxies, Polyimides, Silicones, Polyurethanes, Parylene, Benzocyclobenzene, among others.

For manufacturing personnel, there is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings including recent extrusion, meniscus, and curtain coating methods used in processing

Additional volumes

Encapsulation Technologies for Electronic Applications

Published: 11th June 2009 Editors: Michael Pecht Haleh Ardebili

Adhesives Technology for Electronic Applications

Published: 30th August 2005 Editors: Dale W. Swanson James J. Licari Dale W. Swanson James J. Licari