Advances in Research and Development - 1st Edition - ISBN: 9780125330220, 9780080542898

Advances in Research and Development, Volume 22

1st Edition

Modeling of Film Deposition for Microelectronic Applications

Serial Editors: Ronald Powell John Vossen Maurice Francombe Abraham Ulman
eBook ISBN: 9780080542898
Imprint: Academic Press
Published Date: 22nd October 1996
Page Count: 290


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Table of Contents

M.J. Brett, S.K. Dew, and T.J. Smy, Thin Film Microstructure and Process Simulation Using SIMBAD. S. Hamaguchi, Mathematical Methods for Thin Films Deposition Simulations. C.-C. Fang, V. Prasad, R.V. Joshi, F. Jones, and J.J. Hsieh, A Process Model for Sputter-Deposition of Thin Films Using Molecular Dynamics. T.S. Cale and V. Mahadev, Feature Scale Transport and Reaction during Low Pressure. Chapter References. Author Index. Subject Index.


Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 22 volumes since 1963. The series contains quality studies of the properties of various thin filmsmaterials and systems. In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.


Researchers in thin films; AVS; microelectronics and computer simulation in this field.


No. of pages:
© Academic Press 1996
Academic Press
eBook ISBN:

About the Serial Editors

Ronald Powell Serial Editor

Affiliations and Expertise

Novellus Systems, Inc., Palo Alto, California

John Vossen Serial Editor

Affiliations and Expertise

RCA Laboratories, Princeton, New Jersey

Maurice Francombe Serial Editor

Affiliations and Expertise

Georgia State University, Atlanta, U.S.A.

Abraham Ulman Serial Editor

Affiliations and Expertise

Polytechnic University, Brooklyn, New York, U.S.A.