Advances in Imaging and Electron Physics, Volume 174

Editor-In-Chief

Preface

Future Contributions

Foreword

Contributors

Acknowledgements

Permission Acknowledgments

Chapter One. Measurement Techniques and Issues

1. Introduction

2. Overview of Measurement Methods and Instrumentation

3. Transmission Line and S-Parameters

4. Millimeter-Wave Network Analyzers

5. Cascading of S-Parameters and Transmission/Transfer T-Parameters

6. Calibration and De-Embedding at MM-Waves

References

Chapter Two. Transmission Lines and Passive Components

1. Introduction

2. Silicon Integrated Circuits and Technology

3. Transmission Lines

4. Electromagnetics of Transmission Lines and Their Discontinuities

5. Transitions

6. Capacitors, Inductors, and Resistors

7. Resonators and Filters for Silicon Integrations of Increased Frequencies

8. Power Dividers And Directional Couplers for SI-Integrated Circuits

9. Packaging of Millimeter-Wave Components and Chips

10. Conclusions

References

Chapter Three. Modeling and Design of High-Frequency Structures Using Artificial Neural Networks and Space Mapping

1. Introduction to Artificial Neural Networks

2. Structure of Artificial Neural Networks

3. Activation Functions

4. Aspects of Artificial Neural Network Training

5. Applications of Artificial Neural Networks to Modeling of on-Chip High-Frequency Devices

6. Introduction to Space Mapping

7. The Space Mapping Concept

8. The Parameter Extraction Step

9. Space Mapping Approaches

10. Space Mapping Optimization and Modeling

11. Applications of Space Mapping

12. Conclusions

References

Chapter Four. Nanoscale FETs

1. Types and Performances of Nanoscale MOSFETs

2. Small-Signal Analysis of MOSFETs at High Frequencies

3. HF Noise Modeling of Multiple-Gate SOI and Laterally Asymmetric Channel MOS Devices

4. Conclusions

References

Chapter Five. RF MEMS Devices for Communication Systems

1. Introduction

2. General Design Considerations

3. MEMS Redundancy Switch Matrices

4. RF MEMS Crossbar Switch Matrices

5. RF MEMS Switch Matrices with Pairwise Connection

6. Switch Matrices for High-Power Applications

7. Tunable RF MEMS Components

8. Discussion

References

Chapter Six. Substrate-Integrated Antennas on Silicon

1. Introduction

2. Some Antenna Fundamentals

3. Fabrication of Antennas on Silicon Substrates

4. Types of Silicon-Based Integrated Antennas

5. Integrated Antenna Measurements

6. Crosstalk and Circuit Noise

7. Effect of Silicon Substrate Resistivity on Antenna Transmission Gain

8. Applications in Wireless Personal Area Networks (WPANS)

9. Single-Chip Radio

10. Photonically Reconfigurable Antennas

11. Carbon Nanotube (CNT) Antennas

12. Vehicular Applications

References

Color Plates

Subject Index

Contents of Volumes 151-173

Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy.
This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

• Contributions from leading authorities
• Informs and updates on all the latest developments in the field

Physicists, electrical engineers and applied mathematicians in all branches of image processing and microscopy as well as electron physics in general