Advances in CMP Polishing Technologies

1st Edition

Editors: Toshiro Doi Ioan D. Marinescu Syuhei Kurokawa
Hardcover ISBN: 9781437778595
eBook ISBN: 9781437778601
Imprint: William Andrew
Published Date: 6th December 2011
Page Count: 328
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Description

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community.

Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.

Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

Key Features

  • Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering
  • Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments
  • The authors bring together the latest innovations and research from the USA and Japan

Readership

Mechanical and electrical engineers in the precision manufacturing and semiconductor industries; scientists and engineers working in the fields of CMP, polishing and tribology

Table of Contents

  • Contributors
  • Preface
  • About the Authors
  • Chapter 1. Introduction
  • Chapter 2. Details of the Fabrication Process for Devices with a Silicon Crystal Substrate
    • 2.1. History of Semiconductor Devices and their Types
    • 2.2. Semiconductor Device Process Technology and current Situation
  • Chapter 3. The Current Situation in Ultra-Precision Technology – Silicon Single Crystals as an Example
    • 3.1. Production of Single Crystal Silicon
    • 3.2. Slicing: Pre- and Post-Process
    • 3.3. Lapping of Silicon
    • 3.4. Etching
    • 3.5. Ultra-Precision Polishing/CMP of Silicon Wafers
    • 3.6. Precision Cleaning (Wet Cleaning)
    • 3.7. Inspection of Crystal Substrate
  • Chapter 4. Applications of Ultra-Precision CMP in Device Processing
    • 4.1. Overview of the Significance of, and Trends in, Planarization CMP
    • 4.2. Basic Structure of the CMP System
    • 4.3. Element Technology
    • 4.4. Role of Slurry in CMP
    • 4.5. Role of Pads in CMP
    • 4.6. Advanced Evaluation of Pad Surface Texture
    • 4.7. Cleaning after CMP
    • 4.8. Surface Defects and Inspection Tools in CMP
    • 4.9. Planarization Simulation Technique (Prediction/Management/Evaluation Technique)
  • Chapter 5. Promising Future Processing Technology
    • 5.1. Electrolytic CMP (E-CMP) and Applied Techniques
    • 5.2. ELID Grinding of Sapphire – Experimental Approach
    • 5.3. ELID Grinding of Sapphire with Acoustic Emission Monitoring
    • 5.4. Novel Bell-Jar Shaped, Sealed, Atmosphere Controlled CMP Machine, and Precision Processing of Various Functional Materials
    • 5.5. Dry Etching and Planarization CMP Applications for Surface Micro-Machining
  • Chapter 6. Progress of the Semiconductor and Silicon Industries – Growing Semiconductor Markets and Production Areas

Details

No. of pages:
328
Language:
English
Copyright:
© William Andrew 2011
Published:
Imprint:
William Andrew
eBook ISBN:
9781437778601
Hardcover ISBN:
9781437778595
Paperback ISBN:
9780128103562

About the Editor

Toshiro Doi

Affiliations and Expertise

Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan

Ioan D. Marinescu

Affiliations and Expertise

University of Toledo, OH, USA

Syuhei Kurokawa