Description

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community.

Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.

Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

Key Features

Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering

Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments

The authors bring together the latest innovations and research from the USA and Japan

Readership

Mechanical and electrical engineers in the precision manufacturing and semiconductor industries; scientists and engineers working in the fields of CMP, polishing and tribology.

Details

No. of pages:
328
Language:
English
Copyright:
© 2011
Published:
Imprint:
William Andrew
Print ISBN:
9781437778595
Electronic ISBN:
9781437778601

About the authors

Toshiro Doi

Affiliations and Expertise

Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan

Ioan D. Marinescu

Affiliations and Expertise

University of Toledo, OH, USA