Advanced Adhesives in Electronics

Advanced Adhesives in Electronics

Materials, Properties and Applications

1st Edition - May 25, 2011

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  • Editors: M O Alam, C Bailey
  • eBook ISBN: 9780857092892
  • Paperback ISBN: 9780081017326

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Description

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Key Features

  • Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications
  • Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems
  • Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Readership

Materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Table of Contents

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    Chapter 1: Introduction to adhesives joining technology for electronics

    Abstract:

    1.1 Introduction

    1.2 Classification of adhesives used in electronic packaging

    1.3 A brief overview of electronic assemblies

    1.4 Typical uses of advanced adhesives in electronics

    Chapter 2: Thermally conductive adhesives in electronics

    Abstract:

    2.1 Introduction

    2.2 Model of heat conductance

    2.3 Heat transport in thermally conductive adhesives

    2.4 Thermally conductive fillers

    2.5 Role of polymer base materials

    2.6 Thermal conductivity of adhesives and methods for its measurement

    2.7 Conclusions

    Chapter 3: Anisotropic conductive adhesives in electronics

    Abstract:

    3.1 Introduction

    3.2 Nature of adhesive bond

    3.3 Materials and processing

    3.4 Critical loading

    3.5 Evaluation methods

    3.6 Case studies

    3.7 Conclusions

    3.8 Acknowledgments

    3.10 Appendix: List of abbreviations

    Chapter 4: Isotropic conductive adhesives in electronics

    Abstract:

    4.1 Introduction

    4.2 General isotropic conductive adhesive (ICA) properties

    4.3 Reliability

    4.4 Modeling

    4.5 Nanotechnologies in isotropic conductive adhesives

    4.6 Conclusions

    Chapter 5: Underfill adhesive materials for flip chip applications

    Abstract:

    5.1 Introduction: flip chip and direct chip attachment technology

    5.2 Advantages of direct chip attachment technology

    5.3 Reliability challenge of flip chip technology

    5.4 Advances in the flip chip underfill process and encapsulant materials

    5.5 New material challenges to lead-free solder

    5.6 The ′no-flow′ pre-applied underfill process

    5.7 The wafer level pre-applied underfill process

    5.8 The wafer level dual encapsulation process

    5.9 Conclusions

    Chapter 6: Structural integrity of metal–polymer adhesive interfaces in microelectronics

    Abstract:

    6.1 Introduction

    6.2 Theoretical considerations of work of fracture and bonding strength of adhesive joints

    6.3 Chemical and physical intermolecular interactions at interfaces

    6.4 Other influential factors determining bond strength of real adhesive joints

    6.5 Effect of environmental factors

    6.6 Interconnections using electrically conductive adhesives

    6.7 Conclusions

    Chapter 7: Modelling techniques used to assess conductive adhesive properties

    Abstract:

    7.1 Introduction

    7.2 Numerical modelling technologies

    7.3 Modelling applied to packaging processes

    7.4 Modelling the thermal, electrical and mechanical performance of adhesives

    7.5 Future trends

    7.6 Conclusions

    Chapter 8: Adhesive technology for photonics

    Abstract:

    8.1 Introduction

    8.2 The major characteristics of adhesives for photonic applications

    8.3 Types of adhesive used in photonics

    8.4 Major applications of adhesives in photonics

    8.5 Adhesives for photonic packaging

    8.6 Adhesives used in photonic devices

    8.7 Typical challenges for reliable fabrication of photonic devices

    8.8 Conclusions

    Index

Product details

  • No. of pages: 280
  • Language: English
  • Copyright: © Woodhead Publishing 2011
  • Published: May 25, 2011
  • Imprint: Woodhead Publishing
  • eBook ISBN: 9780857092892
  • Paperback ISBN: 9780081017326

About the Editors

M O Alam

M. O. Alam is a Researcher in the School of Computing and Mathematical Sciences at the University of Greenwich, UK.

C Bailey

Christopher Bailey is a Professor in the School of Computing and Mathematical Sciences at the University of Greenwich, UK.

Affiliations and Expertise

University of Greenwich, UK

Ratings and Reviews

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  • Karel K. Mon Mar 09 2020

    Comprehensible and complete

    This book has been written well and covers many topics, with sufficient depth and good pointers for further research.