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Adhesives Technology for Electronic Applications
Materials, Processing, Reliability
- 1st Edition - August 30, 2005
- Authors: James J. Licari, Dale W. Swanson
- Language: English
- eBook ISBN:9 7 8 - 0 - 8 1 5 5 - 1 6 0 0 - 2
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In… Read more
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Request a sales quoteThis book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.
Electronics and materials engineers in the automotive, medical, semiconductors, space, plastics, and military industries.
1. Introduction
1.1 Adhesives Types and Definitions
1.2 Summary of Packaging Technologies
1.3 History of Adhesives in Electronic Applications
1.4 Comparison of Polymer Adhesives with Metallurgical and Vitreous Attachment Materials
1.5 Specifications
1.6 The Market
2. Functions and Theory of Adhesives
2.1 Mechanical Attachment
2.2 Electrical Connections
2.3 Thermal Dissipation
2.4 Stress Dissipation
3. Chemistry, Formulation, and Properties of Adhesives
3.1 Chemistry
3.2 Formulation of Adhesives
3.3 Properties
4. Adhesive Bonding Properties
4.1 Cleaning
4.2 Surface Treatments
4.3 Adhesive Dispensing
4.4 Placement of Devices and Components
4.5 Curing
4.6 Rework
5. Applications
5.1 General Applications
5.2 Specific Applications
6. Reliability
6.1 Failure Modes and Mechanisms
6.2 Specifications
7. Test and Inspection Methods
7.1 Physical Tests
7.2 Electrical Tests
7.3 Environmental Tests
7.4 Thermal Tests
7.5 Mechanical and Thermomechanical Tests
7.6 Chemical Analysis
Appendix
Conversion Factors
Abbreviations and Acronyms
Index
1.1 Adhesives Types and Definitions
1.2 Summary of Packaging Technologies
1.3 History of Adhesives in Electronic Applications
1.4 Comparison of Polymer Adhesives with Metallurgical and Vitreous Attachment Materials
1.5 Specifications
1.6 The Market
2. Functions and Theory of Adhesives
2.1 Mechanical Attachment
2.2 Electrical Connections
2.3 Thermal Dissipation
2.4 Stress Dissipation
3. Chemistry, Formulation, and Properties of Adhesives
3.1 Chemistry
3.2 Formulation of Adhesives
3.3 Properties
4. Adhesive Bonding Properties
4.1 Cleaning
4.2 Surface Treatments
4.3 Adhesive Dispensing
4.4 Placement of Devices and Components
4.5 Curing
4.6 Rework
5. Applications
5.1 General Applications
5.2 Specific Applications
6. Reliability
6.1 Failure Modes and Mechanisms
6.2 Specifications
7. Test and Inspection Methods
7.1 Physical Tests
7.2 Electrical Tests
7.3 Environmental Tests
7.4 Thermal Tests
7.5 Mechanical and Thermomechanical Tests
7.6 Chemical Analysis
Appendix
Conversion Factors
Abbreviations and Acronyms
Index
- No. of pages: 475
- Language: English
- Edition: 1
- Published: August 30, 2005
- Imprint: William Andrew
- eBook ISBN: 9780815516002
JL
James J. Licari
has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes.
Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)
Affiliations and expertise
AvanTeco, Whittier, CA, USADS
Dale W. Swanson
Affiliations and expertise
has over 29 years experience in Materials and process engineeringRead Adhesives Technology for Electronic Applications on ScienceDirect