
Adhesives Technology for Electronic Applications
Materials, Processing, Reliability
Description
Key Features
- A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals
- Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device
- Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel
Readership
Table of Contents
- Dedication
- Preface
- Acknowledgments
- Disclaimer
- 1. Introduction
- 1.1. Adhesive types and classifications
- 1.2. Summary of packaging technologies
- 1.3. History of adhesives in electronic applications
- 1.4. Comparison of polymer adhesives with metallurgical and vitreous attachment materials
- 1.5. Specifications
- 1.6. Market and market trends
- 2. Functions and theory of adhesives
- 2.1. Mechanical attachment
- 2.2. Electrical connections
- 2.3. Thermal dissipation
- 2.4. Stress dissipation
- Chapter 3. Chemistry, Formulation, and Properties of Adhesives
- 3.1. Chemistry
- 3.2. Formulation additives
- 3.3. Formulation processes
- 3.4. Properties
- Chapter 4. Adhesive Bonding Processes
- 4.1. Cleaning
- 4.2. Surface treatments
- 4.3. Adhesive dispensing
- 4.4. Placement of devices and components
- 4.5. Curing
- 4.6. Rework
- Chapter 5. Applications
- 5.1. General applications
- 5.2. Specific applications
- Chapter 6. Reliability
- 6.1. Physics of failure methodology
- 6.2. Failure modes and mechanisms
- 6.3. Reliability prediction and modeling
- 6.4. Qualification, quality control, and specifications
- Chapter 7. Test and Inspection Methods
- 7.1. Physical tests
- 7.2. Electrical tests
- 7.3. Environmental tests
- 7.4. Thermal tests
- 7.5. Mechanical and thermomechanical tests
- 7.6. Chemical analysis
- Appendix
- Index
Product details
- No. of pages: 512
- Language: English
- Copyright: © William Andrew 2011
- Published: June 23, 2011
- Imprint: William Andrew
- eBook ISBN: 9781437778908
- Paperback ISBN: 9780128103708
About the Authors
James J. Licari
Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)
Affiliations and Expertise
Dale W. Swanson
Affiliations and Expertise
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