Adhesives Technology for Electronic Applications

1st Edition

Materials, Processing, Reliability

Authors: James J. Licari James J. Licari Dale W. Swanson Dale W. Swanson
Hardcover ISBN: 9780815515135
eBook ISBN: 9780815516002
Imprint: William Andrew
Published Date: 30th August 2005
Page Count: 475
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Table of Contents

1. Introduction 1.1 Adhesives Types and Definitions 1.2 Summary of Packaging Technologies 1.3 History of Adhesives in Electronic Applications 1.4 Comparison of Polymer Adhesives with Metallurgical and Vitreous Attachment Materials 1.5 Specifications 1.6 The Market 2. Functions and Theory of Adhesives 2.1 Mechanical Attachment 2.2 Electrical Connections 2.3 Thermal Dissipation 2.4 Stress Dissipation 3. Chemistry, Formulation, and Properties of Adhesives 3.1 Chemistry 3.2 Formulation of Adhesives 3.3 Properties 4. Adhesive Bonding Properties 4.1 Cleaning 4.2 Surface Treatments 4.3 Adhesive Dispensing 4.4 Placement of Devices and Components 4.5 Curing 4.6 Rework 5. Applications 5.1 General Applications 5.2 Specific Applications 6. Reliability 6.1 Failure Modes and Mechanisms 6.2 Specifications 7. Test and Inspection Methods 7.1 Physical Tests 7.2 Electrical Tests 7.3 Environmental Tests 7.4 Thermal Tests 7.5 Mechanical and Thermomechanical Tests 7.6 Chemical Analysis Appendix Conversion Factors Abbreviations and Acronyms Index

Description

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Readership

Electronics and materials engineers in the automotive, medical, semiconductors, space, plastics, and military industries.


Details

No. of pages:
475
Language:
English
Copyright:
© William Andrew 2005
Published:
Imprint:
William Andrew
eBook ISBN:
9780815516002
Hardcover ISBN:
9780815515135

Reviews

"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both." - George Riley


About the Authors

James J. Licari Author

has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes. Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)

Affiliations and Expertise

AvanTeco, Whittier, CA, USA

James J. Licari Author

has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes. Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)

Affiliations and Expertise

AvanTeco, Whittier, CA, USA

Dale W. Swanson Author

Affiliations and Expertise

has over 29 years experience in Materials and process engineering

Dale W. Swanson Author

Affiliations and Expertise

has over 29 years experience in Materials and process engineering