A Guide to Analog ASICs

A Guide to Analog ASICs

1st Edition - December 3, 1991

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  • Author: Paul M. Jr. Brown
  • eBook ISBN: 9780323154765

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A Guide to Analog ASICs is a working reference for the engineer who regularly uses analog custom technology or plans to use it in a product. The book includes a detailed analysis of analog and digital application specific integrated circuits (ASICs), the vendor selection process, cost trade-offs, and design-options (in-house, design center, use of vendor design resources). After introducing the development of analog ASICs, ASIC vendors, development cycles, and cost considerations, the text reviews basic global semiconductor technology, IC fabrication techniques, and the limitations of linear IC design. The components found inside the chip are integrated resistors, capacitors, transistors, diodes, and metal connections. The text explains building block circuits, how these are used to construct complex circuitry, and how the Simulation Program with Integrated Circuit Emphasis (SPICE) can check for circuit performance. The selection of the chip's package is important and depends on several factors, such as thermal size, physical size, PC board technology, number of pins, die size. When tested, a typical product should have a failure rate that follows a curve composed of a failure rate (X-axis) versus time (Y-axis). The book also provides suggestions on vendor selections including vendor identification, site visitation, and price negotiations. The book is suitable for computer engineers, designers of industrial processes, and researchers involved in electrical, computer, or other devices using integrated circuits.

Table of Contents

  • Preface

    Chapter 1 An Introduction to Analog ASICs

    1.0 A Historical Look at Analog ASICs

    1.1 Analog ASIC Products and Development Cycles

    1.2 Vendors and Product Offerings

    Chapter 2 Integrated Circuit Fabrication Technology

    2.0 Silicon—The Material

    2.1 pn Junctions

    2.2 Bipolar Transistor Operation

    2.3 Semiconductor Processing


    Chapter 3 Integrated Circuit Components

    3.0 Introduction

    3.1 pn Junctions

    3.2 Resistors

    3.3 Bipolar Transistors

    3.4 Diodes

    3.5 Junction Field-Effect Transistors

    3.6 Capacitors

    3.7 Metal Interconnection

    3.8 Parasitic Effects


    Chapter 4 SPICE Simulation

    4.0 Introduction to SPICE

    4.1 SPICE Analysis

    4.2 SPICE Input Format

    4.3 Passive Components

    4.4 Current and Voltage Sources

    4.5 Active Components

    4.6 Subcircuits

    4.7 Analysis Control

    4.8 Output Control

    4.9 Typical Model Parameters


    Chapter 5 Circuit Design

    5.0 Introduction to Linear Integrated Design

    5.1 Current Sources and Biasing Techniques

    5.2 Voltage References

    5.3 Amplifiers

    5.4 Oscillators

    5.5 Nonlinear Circuits

    5.6 Timers

    5.7 Logic Circuits

    5.8 Circuit Configurations

    5.9 Worst-Case Considerations


    Chapter 6 Integrated Circuit Layout Considerations

    6.0 Introduction

    6.1 Choosing the Array

    6.2 Macro (Chip-Level) Layout

    6.3 Micro (Circuit-Level) Layout

    Chapter 7 Packaging

    7.0 Introduction

    7.1 Packaging Options

    7.2 Thermal Design

    7.3 Package Selection


    Chapter 8 Testing

    8.0 Introduction

    8.1 Electrical Testing

    8.2 Environmental Testing/Quality Assurance

    Chapter 9 Custom IC Economics

    9.0 Introduction

    9.1 Defining the Custom IC

    9.2 Estimating the Value of a Custom IC

    9.3 Estimating the Cost of a Custom IC

    9.4 Making Decisions

    Chapter 10 Choosing an ASIC Vendor

    10.0 Introduction

    10.1 Initial Screening

    10.2 Questions to Ask Potential Vendors

    10.3 Vendor Facility Visit

    10.4 Negotiating

    10.5 Managing the Development


Product details

  • No. of pages: 350
  • Language: English
  • Copyright: © Academic Press 1991
  • Published: December 3, 1991
  • Imprint: Academic Press
  • eBook ISBN: 9780323154765

About the Author

Paul M. Jr. Brown

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