A Guide to Analog ASICs

1st Edition - December 3, 1991
Author: Paul M. Jr. Brown
Language: English
eBook ISBN:
9 7 8 - 0 - 3 2 3 - 1 5 4 7 6 - 5

A Guide to Analog ASICs is a working reference for the engineer who regularly uses analog custom technology or plans to use it in a product. The book includes a detailed analysis… Read more

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A Guide to Analog ASICs is a working reference for the engineer who regularly uses analog custom technology or plans to use it in a product. The book includes a detailed analysis of analog and digital application specific integrated circuits (ASICs), the vendor selection process, cost trade-offs, and design-options (in-house, design center, use of vendor design resources). After introducing the development of analog ASICs, ASIC vendors, development cycles, and cost considerations, the text reviews basic global semiconductor technology, IC fabrication techniques, and the limitations of linear IC design. The components found inside the chip are integrated resistors, capacitors, transistors, diodes, and metal connections. The text explains building block circuits, how these are used to construct complex circuitry, and how the Simulation Program with Integrated Circuit Emphasis (SPICE) can check for circuit performance. The selection of the chip's package is important and depends on several factors, such as thermal size, physical size, PC board technology, number of pins, die size. When tested, a typical product should have a failure rate that follows a curve composed of a failure rate (X-axis) versus time (Y-axis). The book also provides suggestions on vendor selections including vendor identification, site visitation, and price negotiations. The book is suitable for computer engineers, designers of industrial processes, and researchers involved in electrical, computer, or other devices using integrated circuits.

Preface

Chapter 1 An Introduction to Analog ASICs

1.0 A Historical Look at Analog ASICs

1.1 Analog ASIC Products and Development Cycles

1.2 Vendors and Product Offerings

Chapter 2 Integrated Circuit Fabrication Technology

2.0 Silicon—The Material

2.1 pn Junctions

2.2 Bipolar Transistor Operation

2.3 Semiconductor Processing

References

Chapter 3 Integrated Circuit Components

3.0 Introduction

3.1 pn Junctions

3.2 Resistors

3.3 Bipolar Transistors

3.4 Diodes

3.5 Junction Field-Effect Transistors

3.6 Capacitors

3.7 Metal Interconnection

3.8 Parasitic Effects

References

Chapter 4 SPICE Simulation

4.0 Introduction to SPICE

4.1 SPICE Analysis

4.2 SPICE Input Format

4.3 Passive Components

4.4 Current and Voltage Sources

4.5 Active Components

4.6 Subcircuits

4.7 Analysis Control

4.8 Output Control

4.9 Typical Model Parameters

References

Chapter 5 Circuit Design

5.0 Introduction to Linear Integrated Design

5.1 Current Sources and Biasing Techniques

5.2 Voltage References

5.3 Amplifiers

5.4 Oscillators

5.5 Nonlinear Circuits

5.6 Timers

5.7 Logic Circuits

5.8 Circuit Configurations

5.9 Worst-Case Considerations

References

Chapter 6 Integrated Circuit Layout Considerations

6.0 Introduction

6.1 Choosing the Array

6.2 Macro (Chip-Level) Layout

6.3 Micro (Circuit-Level) Layout

Chapter 7 Packaging

7.0 Introduction

7.1 Packaging Options

7.2 Thermal Design

7.3 Package Selection

References

Chapter 8 Testing

8.0 Introduction

8.1 Electrical Testing

8.2 Environmental Testing/Quality Assurance

Chapter 9 Custom IC Economics

9.0 Introduction

9.1 Defining the Custom IC

9.2 Estimating the Value of a Custom IC

9.3 Estimating the Cost of a Custom IC

9.4 Making Decisions

Chapter 10 Choosing an ASIC Vendor

10.0 Introduction

10.1 Initial Screening

10.2 Questions to Ask Potential Vendors

10.3 Vendor Facility Visit

10.4 Negotiating

10.5 Managing the Development

Index