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Materials, Processing, Reliability
To order this title, and for more information, click here
By
James J. Licari, AvanTeco, Whittier, CA, USA
Dale W. Swanson, Boeing Integrated Defense Systems, Anaheim, CA, USA
Included in series
Materials and Processes for Electronic Applications,
Description
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from
theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments,
the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV,
microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures
provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives,
suppliers, and equipment. Each chapter provides comprehensive references.
Audience
Electronics and materials engineers in the automotive, medical, semiconductors, space, plastics, and military industries.
Contents
1. Introduction
1.1 Adhesives Types and Definitions
1.2 Summary of Packaging Technologies
1.3 History of Adhesives in Electronic Applications
1.4 Comparison of Polymer Adhesives with Metallurgical and Vitreous Attachment Materials
1.5 Specifications
1.6 The Market
2. Functions
and Theory of Adhesives
2.1 Mechanical Attachment
2.2 Electrical Connections
2.3 Thermal Dissipation
2.4 Stress Dissipation
3. Chemistry,
Formulation, and Properties of Adhesives
3.1 Chemistry
3.2 Formulation of Adhesives
3.3 Properties
4. Adhesive Bonding Properties
4.1
Cleaning
4.2 Surface Treatments
4.3 Adhesive Dispensing
4.4 Placement of Devices and Components
4.5 Curing
4.6 Rework
5. Applications
5.1 General Applications
5.2 Specific Applications
6. Reliability
6.1 Failure Modes and Mechanisms
6.2 Specifications
7. Test and Inspection
Methods
7.1 Physical Tests
7.2 Electrical Tests
7.3 Environmental Tests
7.4 Thermal Tests
7.5 Mechanical and Thermomechanical Tests
7.6
Chemical Analysis
Appendix
Conversion Factors
Abbreviations and Acronyms
Index
| Bibliographic details |
Hardbound, 475 pages, publication date: AUG-2005
ISBN-13: 978-0-8155-1513-5
ISBN-10: 0-8155-1513-8
Imprint: WILLIAM ANDREW
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| Price and Ordering |
Price:
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USD 190
EUR 135.95
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Last update: 3 Oct 2009
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