ELECTRONICS RELIABILITY AND MEASUREMENT TECHNOLOGY
Nondestructive Evaluation To order this title, and for more information, click here
By Joseph S. Heyman
Description This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for
nondestructive evaluation, and it details common measurement trouble spots.
Audience
Quality assurance managers and reliability engineers in the electronics industry.
Contents Measurement Science and Manufacturing Science Research
The Members Dollar
SRC Structure
An Industry View of the Future Direction
of Manufacturing Science (Through 1955) Generated by the TAB Manufacturing Sciences Committee
Future Directions of the Manufacturing
Sciences Program
Major Trends-Semiconductors
Equipment Implications
Semiconductor Equipment Business
Semiconductor Capital Investment
Plans
Worldwide Sales Forecast
1985 Semiconductor Equipment Sales
Major Trends-Semiconductor Equipment
Programs
Manufacturing
Sciences Principal Thrusts
The SRC/University of Michigan Program in Automated Semiconductor Manufacturing
Manufacturing Sciences
Significant Accomplishments
Nondestructive SEM for Surface and Subsurface Wafer Imaging
Introduction
Image Processing Storage and
Retrieval
Time Resolved Capacitive Coupling Voltage Contrast
Nondestructive Subsurface Imaging of Semiconductors
References
Surface
Inspection-Research and Development
Introduction
Trends in Surface Analysis
New Front End Detection Techniques
Tool Development
Research Topics
Sensors Developed for In-Process Thermal Sensing and Imaging
References
Wafer Level Reliability for High-Performance
VLSI Design
Introduction
Wafer Level Tests
Wafer Level Electromigration Tests
Mobile Ion Contamination
Schottky Diode Structures
Wafer Level Device Reliability
Future Wafer Level Testing
Conclusions
References
Wafer Level Reliability Testing: an Idea Whose
Time Has Come
Planting Seeds
Initial Results
With or Without Wafer Level Reliability Testing
CAR
1986 Workshop
Micro-Focus
X-Ray Imaging
Introduction
The Need for Solder Quality Inspection
Stress and Electrical Testing
Visual Inspection
Structural
Inspection
Developing a Solder Quality Inspection machine
Results Achieved with the First Machine
The Importance of Accept/Reject
Thresholds
The ""Structural"" Solder Quality Standards Problem
Conclusions
Measurement of Opaque Film Thickness
Introduction
Description of Thermal Waves and Experimental Technique
Thermal Diffusivity of an Isotropic Solid
Theoretical Framework for Thin
Film Calculations
Numerical Calculations and Experimental Results: Cu Film on Glass
Summary and Conclusions
References
Intelligent
Laser Soldering Inspection and Process Control
Introduction
Novel Approach: Thermal Flow
The Laser/Inspect System
Statistical
Data
Inspecting Tab Assemblies
Intelligent Laser Solderer
Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections
in High-Speed, High-Density Circuits
Introduction
Type of Interconnecting Material
The Control of Microcracking in Type E Copper
Hot Rupture Testing
Setting Quality Control Standards-Dynamic Rupture
Quality Control by Creep-Rupture Testing
Summary and Conclusions
References
Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
Holographic Interferometry
Applications in Electronics (Documented)
Other Applications
Homodyne Construction
Homodyne Display
Heterodyne Recording
Contouring
Using HHI
Quasi-Heterodyne Readout
Wear Contours
Heterodyne Readout
Wear Contours
Surface Acoustic Wavefront
Advantages
Limitations
""Whole Wafer"" Scanning Electron Microscopy
Historical Perspective
Step Coverage Parameters
Today's Response by Industry
Choices/Status
Courses of Action
Whole Wafer Scanning Exposes the Wafer
Back Matter
Bibliographic details
Hardbound, 140 pages, publication date: DEC-1998
ISBN-13: 978-0-8155-1171-7
ISBN-10: 0-8155-1171-X
Imprint: WILLIAM ANDREW
Price and Ordering
Price: GBP 88.99 USD 147 EUR 104.95
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