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| HARDENING SEMICONDUCTOR COMPONENTS AGAINST RADIATION AND TEMPERATURE
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By
William R. Dawes
Description
This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on
electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for
hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology.
Audience
Semiconductor manufacturers, engineers, researchers, and management.
Contents
Interaction of Hazardous Environments with Electronic Devices
Hardened Technologies for Hazardous Environments
Circuit Design for Reliable
Operations in Hazardous Environments
Packaging, Testing, and Hardness Assurance
| Bibliographic details |
Hardbound, 340 pages, publication date: DEC-1990
ISBN-13: 978-0-8155-1212-7
ISBN-10: 0-8155-1212-0
Imprint: WILLIAM ANDREW
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| Price and Ordering |
Price:
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USD 147
EUR 104.95
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Last update: 3 Oct 2009
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