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| HANDBOOK OF SILICON WAFER CLEANING TECHNOLOGY, 2ND EDITION
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To order this title, and for more information, click here
Second Edition
Edited By
Karen Reinhardt, Cameo Consulting, San Jose, California, U.S.A
Description
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface
conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing
flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes.
The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue,
and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies
is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including
supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how
these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers
surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing
is also included.
Audience
Managers, engineers, and technicians that manufacture integrated circuits or supply the semiconductor and microelectronics industries.
Contents
Part 1: Introduction and Overview
1. Overview and Evolution of Silicon Wafer Cleaning Technology
2. Overview of Wafer Contamination and
Defectivity
Part 2: Wet-Chemical Processes
3. Particle Deposition and Adhesion
4. Aqueous Cleaning and Surface Conditioning Processes
Part 3: Dry Cleaning Processes
5. Gas-phase Wafer Cleaning Technology
6. Plasma Stripping and Cleaning
7. Cryogenic Aerosols and Supercritical
Fluid Cleaning
Part 4: Analytical and Control Aspects
8. Detection and Measurement of Particulate Contaminants
9. Surface Chemical Composition
and Morphology
10. Ultratrace Impurity and Surface Morphology Analysis
11. Analysis and Control of Electrically Active Contaminants
Part
5: Directions for the Near Future
| Bibliographic details |
Hardbound, 660 pages, publication date: JAN-2008
ISBN-13: 978-0-8155-1554-8
ISBN-10: 0-8155-1554-5
Imprint: WILLIAM ANDREW
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| Price and Ordering |
Price:
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USD 249
EUR 177.95
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Last update: 13 Nov 2009
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