Edited by
Karen Reinhardt, Cameo Consulting, San Jose, California, U.S.A
Werner Kern, Lam Research, San Diego, California
Description
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface
conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing
flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes.
The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue,
and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies
is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including
supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how
these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers
surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing
is also included.
Audience:
Managers, engineers, and technicians that manufacture integrated circuits or supply the semiconductor and microelectronics industries.
