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By Jon Wilson, Principal Consultant, The Dynamic Consultant, CA, USA Stuart Ball, Embedded Systems consultant and author Creed Huddleston, Real-Time by Design, LLC, Raleigh, NC, USA Edward Ramsden, Senior Engineer, Lattice Semiconductor, Hillsboro, OR, USA Dogan Ibrahim, Traffic Control Systems Unit, South Bank University, Near East University, UK
Audience
Field Application Engineers; Electronics Engineers; Communications Engineers
Contents Chapter 1 Fundamental of measurement
1.1 Introduction
1.2 Fundamental concepts
Bibliography
Chapter 2 Sensors and Transducers
2.1 Basic
Sensor Technology
2.2 Sensor Systems
2.3 Application Considerations
2.4 Sensor Characteristics
2.5 System Characteristics
2.6 Instrument
Selection
2.7 Data Acquisition and Readout
2.8 Installation
2.9 Measurement Issues and Criteria
Chapter 3. Data acquisition hardware
and software
3.1 ADCs
3.2 Types of ADCs
3.3 ADC Comparison
3.4 Sample and Hold
3.5 Real Parts
3.6 Microprocessor Interfacing
3.7 Clocked
Interfaces
3.8 Serial Interfaces
3.9 Multichannel ADCs
3.10 Internal Microcontroller ADCs
3.11 Codecs
3.12 Interrupt Rates
3.13 Dual-Function
Pins on Microcontrollers
3.14 Design Checklist
Chapter 4. Overview of measurement systems
4.1 Transducers
4.2 Methods of measurement
4.3 Sensitivity
4.4 Zero, linearity and span
4.5 Resolution, hysteresis and error
4.6 Fourier analysis
4.7 Dynamic response
4.8 PID control
4.9 Accuracy and repeatability
4.10 Mechanical models
Chapter 5 Acceleration, Shock and Vibration
5.1 Introduction
5.2 Technology Fundamentals
5.3 Selecting and Specifying Accelerometers
5.4 Applicable Standards
5.5 Interfacing and Designs
5.6 Machinery Vibration Monitoring Sensors
Chapter 6 Flow
6.1 General
6.2 Differential pressure flowmeters
6.3 Turbine flowmeters
6.4 Vortex shedding flowmeters
6.5 Electromagnetic
flowmeters
6.6 Ultrasonic flowmeters
6.7 Hot wire anemometer
6.8 Mass flowmeters
Chapter 7 Temperature
7.1 Temperature scales
7.2 Types
of temperature sensors
7.3 Measurement errors
7.4 Selecting a temperature sensor
7.5 Thermocouple Temperature Sensors
7.6 RTD Temperature
Sensors
7.7 Thermistor Temperature Sensors
7.8 Integrated Circuit Temperature Sensors
Chapter 8 Pressure
8.1 Introduction
8.2 SI and
other units
8.3 Absolute, gauge and differential pressure modes
8.4 Primary standards
8.5 Spinning ball gauge standard
8.6 Secondary
standards
8.7 Working standards
8.8 Pressure measuring instruments
8.9 Calibration of pressure standards and instruments
Bibliography
Chapter 9. Position
9.1 Mechanical switch
9.2 Potentiometric sensor
9.3 Capacitive transducer
9.4 LVDT
9.5 Angular velocity transducer
9.6 Position sensitive diode array
9.7 Motion control
Chapter 10 Strain gauges, loadcells and weighing
10.1 Introduction
10.2 Stress
and strain
10.3 Strain gauges
10.4 Bridge circuits
10.5 Load cells
10.6 Weighing systems
Chapter 11 Light
11.1 Light
11.2 Measuring
light
11.3 Standards of measurement
11.4 Thermal detectors
11.5 Light dependent resistor (LDR)
11.6 Photodiode
11.7 Other semiconductor
photodetectors
11.8 Optical detectors
11.9 Photomultiplier
Chapter 12 Signal Processing and Conditioning
12.1 Conditioning Bridge Circuits
References
12.2 Amplifiers for Signal Conditioning
References
Chapter 13 Interfacing and Data Communications
13.1 Interfacing
13.2 Input/Output
ports
13.3 Polling
13.4 Interrupts
13.5 Direct memory access (DMA)
13.6 Serial port
13.7 Serial port addresses
13.8 Serial port registers
13.9 Serial port registers and interrupts
13.10 Serial port baud rate
13.11 Serial port operation
13.12 Parallel printer port
13.13 Parallel
port registers
13.14 Parallel printer port operation
13.15 Communications
13.16 Byte to serial conversion
13.17 RS232 interface
13.18
Synchronisation
13.19 UART (6402)
13.20 Line drivers
13.21 UART clock
13.22 UART Master Reset
13.23 Null modem
13.24 Serial port BIOS
services
13.25 Serial port operation in BASIC
13.26 Hardware handshaking
13.27 RS485
13.28 GPIB
13.29 USB
13.30 TCP/IP
Chapter 14 Data
acquisition software
14.1 An overview of DA&C software
14.2 Data acquisition and control in real time
14.3 Implementing real-time systems
on the PC
14.4 Robustness, reliability and safety
Chapter 15. Scaling and calibration
15.1 Scaling of linear response curves
15.2 Linearization
15.3 Polynomial linearization
15.4 Interpolation between points in a look-up table
15.5 Interpolation vs. power-series polynomials
15.6
Interactive calibration programs
15.7 Practical issues
Chapter 16. Synthetic instruments
16.1 What is a Synthetic Instrument?
16.2 History
of Automated Measurement
16.3 Synthetic Instruments Defined
16.4 Advantages of Synthetic Instruments
16.5 Synthetic Instrument Misconceptions
16.6 Synthetic Measurement System Hardware Architectures
16.7 System Concept?The CCC Architecture
16.8 Hardware Requirements Traceability
16.9 Stimulus
16.10 Stimulus Digital Signal Processing
16.11 Stimulus Triggering
16.12 The Stimulus D/A
16.13 Stimulus Conditioning
16.14
Stimulus Cascade?Real-World Example
16.15 Real-World Design: A Synthetic Measurement System
16.16 Universal High-Speed RF Microwave Test
System
16.17 System Architecture
16.18 DUT Interface
16.19 Calibration
16.20 Software Solutions
16.21 Conclusions
Chapter 17 Real-world
measurement applications
17.1 Precision Measurement and Sensor Conditioning
References
Chapter 18. Testing methods
18.1 The Order-of-Magnitude
Rule
18.2 A Brief (Somewhat Apocryphal) History of Test
18.3 Test Options
18.4 Summary
Chapter 19 Boundary Scan Techniques
19.1 Latch-Scanning
Arrangements
19.2 Enter Boundary Scan
19.3 Hardware Requirements
19.4 Modes and Instructions
19.5 Implementing Boundary Scan
19.6 Partial-Boundary-Scan
Testing
19.7 Other Alternatives
19.8 Summary
Chapter 20 Inspection Test
20.1 Striking a Balance
20.2 Post-Paste Inspection
20.3 Post-Placement/Post-Reflow
20.4 Summary
Chapter 21 EMC fundamentals
21.1 What is EMC?
21.2 Compatibility between and within systems
Chapter 22 Measuring RF
emissions
22.1 Emissions measuring instruments
22.2 Transducers
22.3 Sites and facilities
Chapter 23 Test methods
23.1 Test set-up
23.2
Test procedure
23.3 Tests above 1GHz
23.4 Military emissions tests
23.5 Measurement uncertainty
Chapter 24 Test planning
24.1 The need
for a test plan
24.2 Contents of the test plan
24.3 Immunity performance criteria
CHAPTER 25 Accelerated testing fundamentals
25.1 Scenario
One: A key physical property is wrong.
25.2 Scenario Two: A primary failure mode of a product.
25.3 Scenario Three: The Mean Time to
Failure (MTTF).
Chapter 26 HALT and FMVT
26.1 A Typical HALT
26.2 Hot Temperature Steps
26.3 Cold Temperature Steps
26.4 Ramp Rates
26.5 Vibration
26.6 Combined Run
26.7 Business Structures
26.8 Failure Mode Verification Testing (FMVT)
26.9 Development FMVT
26.10 More
About Stress
26.11 What can break the product?
26.12 More About Failures
26.13 More About Setup and Execution
26.14 More on Data Analysis
26.15 Comparison FMVT
26.16 Method One: Time to First Failure
26.17 Method Two: Failure Mode Progression Comparison
26.18 FMVT Life Prediction – Equivalent Wear and Cycle Counting
26.19 FMVT Warranty
26.20 More on Vibration
26.21 Reliability and Design Maturity
26.22 Business
Considerations
Appendix A: Standard Interfaces
A.1 IEEE 1451.2
A.2 4?20 ma Current Loop
A.3 Fieldbus
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