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| COMPREHENSIVE MICROSYSTEMS, THREE-VOLUME SET, 1-3
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 To order this title, and for more information, click here
Yogesh Gianchandani, EECS Department, University of Michigan, Ann Arbor, MI, USA
Osamu Tabata, Department of Mechanical Engineering, Kyoto University, Yoshida Honmachi, Sakyo-ku, Kyoto
Japan
Hans Zappe, IMTEK - Laboratory for Micro-optics, University of Freiburg, Georges-Köhler-Allee 102, Freiburg, Germany
Description
Comprehensive Microsystems, is a new 3-volume reference work on Microelectromechanical Systems (MEMS). The microsystems field has
expanded to embrace a host of technologies, and microelectronics has now been joined by micro-mechanics, micro-fluidics and micro-optics
to allow the fabrication of complex, multi- functional integrated microsystems. At over 2000 pages, Comprehensive Microsystems
represents the authoritative primary reference source on microsystems. It addresses the need for an overview of the technologies and
capabilities available in this highly interdisciplinary and dynamically-growing engineering field.
Comprehensive Microsystems,
provides an exhaustive overview of the wide range of topics which comprise the microsystems field, including, design and materials, fabrication
and packaging, optical systems, chemical and biological systems, physical sensors, actuation, electronics for MEMS and industrial applications.
Every article in the work has been commissioned by a panel of internationally recognized editors and written by an acknowledged expert
in any one of a variety of disciplines. The articles provide a concise overview of a particular aspect of the microsystems field and
are accompanied by extensive bibliographies, cross-referencing and indexes, enhancing the value of the text. by guiding the user to the
most relevant further reading within the ever-expanding available literature. Much care has been given to avoid overlap and to provide
consistency in style and contents.
Audience
Academics & professionals from industry, MEMS Reseachers, graduate students new to the field.
Contents
Materials
Biocompatible Materials, Silicon and Related Materials, Compound Semiconductors, Polymers, Plastics and Gels, Harsh Environment,
Metals and Alloys
Fabrication and Packaging
Silicon Process Integration, Bonding, Dry Etching, Electroplating, Low-Cost MEMS
Technologies, LIGA, Machining, Micro/Nanoimprinting, Replication, Wet Etching of Silicon-Related Materials, Automated or Self-Assembly,
Packaging, Device Reliability/Lifetime
Design
Design Synthesis, Multiphysics and Multiscale Simulation, Sensor Networks &
Distributed Systems, Testing, Calibration and Compensation
Optical Systems
Artificial Retina, Diffractive Optics, Integrated
Optics, IR Imaging, Micro-Imaging Systems, Micro-Mirrors, Micro-Lenses, MuOCT, Optical Communications, Photonic Crystals
Chemical
and Biological Systems
Gas Sensing System, Lab-on-a-Chip, Biophotonics, Tissue Engineering, Micro-Pumps-Liquid Pumps, Micro-Pumps-Gas
Pumps, Mixers, Chemical Sensing Systems for Liquids, Capacitive Ultrasonic Transduction
Emerging Topics
SPM, MEMS Atomic Clocks,
Micro-combustion, Micro-Coolers, Water Management in Micro-Fuel Cell Systems, Molecular Motors
Physical Sensors
Accelerometers,
Flow Sensors, Gyros, Pressure Sensors
Actuation
Electrostatic Actuation, Magnetic Actuation, Resonators, Oscillators, and Frequency
References
Thermal Actuation, Ink jets
Electronics for MEMS
Distributed Systems, Interface Circuits, Micro-Imaging Systems, Micro-Mirrors,
Micro-Lenses, MuOCT
Optical Communications, Photonic Crystals
Volumes
1-3: Comprehensive Microsystems, Three-Volume Set, 1-3
Bibliographic & ordering Information |
1-3 - Comprehensive Microsystems, Three-Volume Set, 1-3
Hardbound, 2100 pages, publication date: NOV-2007
ISBN: 0-444-52194-1
Imprint: ELSEVIER
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Price:
GBP 1,036
EUR 1,503
USD 1,750
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Last update: 27 Sep 2008
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