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| MATERIALS FOR ELECTRONIC PACKAGING
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By
Deborah Chung, Niagara Mohawk endowed Chief Professor, Professor of Mechanical and Aerospace Engineering, State University of New York
Description
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect.
Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last few
decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for
Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging
of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
Audience
Professionals and advanced graduate students working in electronic materials and packaging.
Contents
Overview of materials for electronic packaging; Solderability fundamentals: role of microscopic processes; Determining the damaging strains
which cause failure in lead tin solders; Fluxless soldering for microelectronic applications, The effect
of microstructure on the bonding
of metal/ceramic interfaces; The future of advanced composite electronic packaging; Low thermal expansion composite materials for electronic
packaging; Electrically conducting polymer-matrix composites; Thick-film technology; Electroless copper for micropackaging and ultra
large scale integrated circuit applications; Vacuum metallization for integrated circuit packages; Electrically conducting polymers and
organic materials; Diamond films; Measurements of properties of materials in electronic packaging.
| Bibliographic details |
Hardbound, 368 pages, publication date: MAR-1995
ISBN-13: 978-0-7506-9314-1
ISBN-10: 0-7506-9314-2
Imprint: BUTTERWORTH HEINEMANN
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| Price and Ordering |
Price:
USD 255
GBP 184
EUR 216.95
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Last update: 7 Sep 2009
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