By
Deborah Chung, Niagara Mohawk endowed Chief Professor, Professor of Mechanical and Aerospace Engineering, State University of New York
Description
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect.
Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last
few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials
for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging
of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
Audience:
Professionals and advanced graduate students working in electronic materials and packaging.
