Materials for Electronic Packaging

Materials for Electronic Packaging on ScienceDirect(Opens new window)
Hardbound, 368 Pages
Published: MAR-1995
ISBN 10: 0-7506-9314-2
ISBN 13: 978-0-7506-9314-1
Imprint: BUTTERWORTH HEINEMANN


By
Deborah Chung, Niagara Mohawk endowed Chief Professor, Professor of Mechanical and Aerospace Engineering, State University of New York

Description
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Audience:
Professionals and advanced graduate students working in electronic materials and packaging.


 
Last update: 5 Nov 2011