HANDBOOK OF DEPOSITION TECHNOLOGIES FOR FILMS AND COATINGS, 2ND ED.
Science, Applications and Technology To order this title, and for more information, click here Second Edition
By Rointan F. Bunshah, University of California at Los Angeles, USA
Description This second edition, edited by the world-renowned Dr. Rointain Bunshah, is an extensive update of the many improvements in deposition
technologies, mechanisms, and applications. Considerably more material was added in Plasma Assisted Vapor Deposition processes, as well
as Metallurgical Coating Applications.
Audience
Engineers, technicians, and plant personnel in the semiconductor and related industries.
Contents 1. Deposition Technologies: An Overview
1.0 The Market
2.0 Introduction
3.0 Aim and Scope
4.0 Definitions and Concepts
5.0
Physical Vapor Deposition (PVD) Process Terminology
6.0 Classification of Coating Processes
7.0 Gas Jet Deposition with Nano-Particles
8.0 Microstructure and Properties
9.0 Unique Features of Deposited Materials and Gaps In Understanding
10.0 Current Applications
11.0 ""Frontier Areas"" for the Application of the Products of Deposition Technology
12.0 Selection Criteria
13.0 Summary
Appendix
1: Deposition Process Definitions
References
2. Plasmas in Deposition Processes
1.0 Introduction
2.0 Particle Motion
3.0 Collective
Phenomena
4.0 Plasma Discharges
5.0 Plasma Volume Reactions
6.0 Surface Reactions
References
3. Surface Preparation for Film
and Coating Deposition Processes
1.0 Introduction
2.0 Contamination
3.0 Environment Control
4.0 Cleaning Processes
5.0 Drying
and Outgassing
6.0 Monitoring of Cleaning
7.0 In Situ Cleaning
8.0 Plasmas
9.0 Storage and Handling
10.0 Activation and Sensitization
11.0 Surface Modification
12.0 Passivation and Preservation
13.0 Safety
References
4. Evaporation: Processes, Bulk Microstructures
and Mechanical Properties
1.0 General Introduction
2.0 Scope
3.0 PVD Processes
4.0 Theory and Mechanisms
5.0 Evaporation Process
and Apparatus
6.0 Evaporation Sources
7.0 Laser Induced Evaporation/Laser Ablation/Pulsed Laser Deposition (PLD)
8.0 Deposition
Rate Monitors and Process Control
9.0 Deposition of Various Materials
10.0 Microstructure of PVD Condensates
11.0 Physical Properties
of Thin Films
12.0 Mechanical and Related Properties
13.0 Purification of Metals by Evaporation
Appendix
References
5. Sputter
Deposition Processes
1.0 Introduction
2.0 Sputtering Mechanisms
3.0 Sputter Deposition Techniques
4.0 Sputter Deposition Modes
References
6. Ion Plating
1.0 Introduction
2.0 Processing Plasma
3.0 Generation of Plasmas
4.0 Plasma Chemistry
5.0 Bombardment
Effects on Surfaces
6.0 Sources of Depositing Atoms
7.0 Reactive Ion Plating
8.0 Bombardment Effects on Film Properties
9.0 Ion
Plating System Requirements
10.0 Process Monitoring and Control
11.0 Problem Areas
12.0 Applications
13.0 Summary
References
7. Chemical Vapor Deposition
1.0 Introduction
2.0 Important Reaction Zones in CVD
3.0 Design of CVD Experiments
4.0 Gas Flow
Dynamics
5.0 Rate-Limiting Steps During CVD
6.0 Reaction Mechanisms
7.0 Nucleation
8.0 Surface Morphology and Microstructure
of CVD Materials
9.0 Selective Deposition
10.0 Some Applications of the CVD Technique
11.0 Outlook
References
8. Plasma-Enhanced
Chemical Vapor Deposition
1.0 Introduction
2.0 Reactor Influence on Plasma Behavior
3.0 Films Deposited by CVD
References
9.
Plasma-Assisted Vapor Deposition Processes: Overview
1.0 Introduction
2.0 Plasma-Assisted Deposition Processes
3.0 Model of a Deposition
Process
4.0 Materials Deposited by Reactive Vapor Deposition Processes
5.0 Key Issues in Plasma-Assisted Reactive Vapor Deposition
Processes
6.0 Plasma-Assisted Deposition Techniques in Current Usage
7.0 Limitations of Current Plasma-Assisted Techniques
8.0
Hybrid Processes
9.0 Conclusions
References
10. Deposition from Aqueous Solutions: An Overview
1.0 Introduction
2.0 General Principles
3.0 Electrodeposition
4.0 Processing Techniques
5.0 Selection of Deposit
6.0 Selected Special Processes
7.0 Structures and
Properties of Deposits
8.0 Summary
Appendix A: Preparation of Substrates for Electroplating
Appendix B: Representative Electroless
Plating Solution Formulation
Appendix C: Comparison of Aluminum Anodizing Processes (Types I, II and III)
References
11. Advanced
Thermal Spray Deposition Techniques
1.0 Introduction
2.0 Equipment and Processes
3.0 Total Coating Process
4.0 Coating Structure
and Properties
5.0 Summary
References
12. Non-Elemental Characterization of Films and Coatings
1.0 Introduction
2.0 Characterization
3.0 Film Formation
4.0 Elemental And Structural Analysis
5.0 Some Property Measurements
6.0 Summary
References
13. Nucleation,
Film Growth, and Microstructural Evolution
1.0 Introduction
2.0 Nucleation and the Early Stages of Film Growth
3.0 Computer Simulations
of Microstructure Evolution
4.0 Microstructure Evolution and Structure-Zone
5.0 Effects of Low-Energy Ion Irradiation During Film
Growth
References
14. Metallurgical Applications
1.0 Introduction
2.0 Corrosion
3.0 Galvanic Corrosion
4.0 EMF and Galvanic
Series
5.0 Coatings for Galvanic Corrosion
6.0 Methods of Deposition of Metallic Coatings
7.0 Examples of Corrosion-Resistant Coatings
8.0 High Temperature Oxidation/Corrosion
9.0 Friction and Wear
10.0 Coatings to Reduce Friction and Wear
References
15. Characterization
of Thin Films and Coatings
1.0 Introduction
2.0 Surface Analysis Techniques
3.0 Imaging Analysis Techniques
4.0 Optical Analysis
Techniques
References
16. Jet Vapor Deposition
1.0 Introduction
2.0 Principles and Apparatus of JVD
3.0 Discussion
4.0 Examples
of JVD Films and Applications
5.0 Summary
References
Index
Bibliographic details
Hardbound, 887 pages, publication date: DEC-1994
ISBN-13: 978-0-8155-1337-7
ISBN-10: 0-8155-1337-2
Imprint: WILLIAM ANDREW
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