Materials, Processes, Design, Testing and Production To order this title, and for more information, click here Second Edition
By James J. Licari, AvanTeco, Whittier, CA, USA Leonard R. Haber, Boeing Electronic Systems, USA
Description The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing
of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding,
die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important
chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive
chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test
hybrid circuits.
Audience
Materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Contents 1. Introduction
1.0 Classification of Materials for Microelectronics
2.0 Classification of Processes
3.0 Definition and Characteristics
of Hybrid Circuits
4.0 Applications
References
2. Substrates
1.0 Functions
2.0 Surface Characteristics
3.0 Alumina Substrates
4.0 Beryllia Substrates
5.0 Aluminum Nitride
6.0 Metal Matrix Composites
7.0 Ceramic Substrate Manufacture
8.0 Enameled Metal
Substrates
9.0 Quality Assurance and Test Methods
References
3. Thin Film Processes
1.0 Deposition Processes
2.0 Thin Film Resistor
Processes
3.0 Photoresist Materials and Processes
4.0 Etching Materials and Processes
5.0 Thin-Film Microbridge Crossover Circuits
References
4. Thick Film Processes
1.0 Fabrication Processes
2.0 Direct Writing
3.0 Paste Materials
4.0 Non-Noble-Metal Thick
Films
5.0 Polymer Thick Films
References
5. Resistor Trimming
1.0 Laser Trimming
2.0 Abrasive Trimming
3.0 Resistor Probing/Measurement
Techniques
4.0 Types of Resistor Trims
5.0 Special Requirements
References
6. Parts Selection
1.0 General Considerations
2.0
Packages
3.0 Active Devices
4.0 Passive Devices
References
7. Assembly Processes
1.0 Introduction
2.0 Die and Substrate Attachment
3.0 Interconnections
4.0 Cleaning
5.0 Particle Immobilizing Coatings
6.0 Vacuum-Baking and Sealing
References
8. Testing
1.0 Electrical Testing
2.0 Visual Inspection
3.0 Nondestructive Screen Tests
4.0 Destructive Screen Tests
References
9. Handling
and Clean Rooms
1.0 Handling of Hybrid Circuits and Components
2.0 Electrostatic Discharge
References
10. Design Guidelines
1.0
Hybrid Microcircuit Design Transmittal
2.0 System Requirements Affecting Hybrid Circuit Design
3.0 Material and Process Selection
4.0 Quality Assurance Provisions
5.0 Hybrid Design Process
6.0 Substrate Parasitics
7.0 Thermal Considerations
8.0 Layout Guidelines
Common to Both Thick- and Thin-Film Hybrids
9.0 Guide to High-Performance Hybrid/MCM/Package Design
10.0 Equations
11.0 Cross-Talk
12.0 Signal Line Capacitance
13.0 Signal-Line Inductance
14.0 Microstrip Propagation Delay
15.0 Typical Material Thicknesses
16.0 Thick-Film Materials and Processes Description
17.0 Thick-Film Design Guidelines
18.0 Thin-Film Guidelines
References
11.
Documentation and Specifications
1.0 Documentation
2.0 Military and Government Specifications
References
12. Failure Analysis
1.0 Types and Causes of Hybrid Failures
2.0 Failure Analysis Techniques
3.0 Analytical Techniques
4.0 Causes of Hybrid Circuit
Failures
5.0 Case Histories of Hybrid Circuit Failures
References
13. Multichip Modules: A New Breed of Hybrid Microcircuits
1.0
Applications
2.0 Interconnect Substrate Designs and Fabrication Methods
3.0 Assembly Methods
4.0 Testing and Testability
5.0
Issues
References
Index
Bibliographic details
Hardbound, 600 pages, publication date: DEC-1998
ISBN-13: 978-0-8155-1423-7
ISBN-10: 0-8155-1423-9
Imprint: WILLIAM ANDREW
Price and Ordering
Price: GBP 108.99 USD 180 EUR 128.95
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