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By Jeorge Hurtarte Evert Wolsheimer Lisa Tafoya, Fabless Semiconductor Association
Description Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing
in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication
deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC
designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships
as it is about physical processes. ?Fabless? ICs are those designed and marketed by one company but actually manufactured by another.
Audience
IC engineers, design engineers (analog and digital), engineering management.
Contents PART 1 – Manufacturing Strategies: Understanding Fabless IC Technology
Chapter 1: More than a Decade of Transition in the Semiconductor
Industry
1.1 FSA is Established
1.2 Early Success
1.3 Early Success Trend Continues
1.4 Semiconductor Business Models
1.5 Outsourcing
Will Accelerate
1.6 IDMs are Going Fabless
1.7 A Case Study: Cypress Semiconductor
1.8 More IDMs are Outsourcing
1.9 Geographic Manufacturing
Centers
Chapter 2: Fabless Semiconductor Manufacturing
2.1 Foundry Revenue Growth
2.2 Semiconductor Back-End Services
2.3 Semiconductor
Equipment
Chapter 3: Qualities of Successful Fabless Companies
3.1 Defining Events for the Fabless Market
3.2 Thriving in the Fabless
Model
3.3 Key Qualities for Success
3.4 The Future of Fabless
PART 2 – An In-Depth Understanding of the Fabless Semiconductor Business
Model
Chapter 4: Semiconductor Manufacturing Basics
4.1 Semiconductor Processes
4.2 Semiconductor Manufacturing Steps
4.3 Wafer Size
4.4 Manufacturing Costs
4.5 Conclusion
Chapter 5: Fabless ASICs
2.1 Introduction
5.2 Origins of the ASIC Industry
5.3 Emergence of the
Fabless ASIC Business Model
5.4 The Fabless ASIC Model: How It Works
5.5 The Services and Capabilities of a Fabless ASIC Supplier
5.6
Conclusion
Chapter 6: Electronic Design Automation
6.1 Fabless EDA Overview
6.2 Fabless EDA Selection Process
6.3 Physical Design EDA
Chapter 7: Intellectual Property
7.1 SIP Industry Overview
7.2 SIP Business Environment
7.3 Sourcing Industry Overview
7.4 Baseline
Terminology
7.5 Finding SIP and Related Products
7.6 Evaluating SIP Business Models
7.7 SIP Product Enablers
7.8 Examples by SIP Product
Type
7.9 Licensing SIP Products
7.10 Provider and Buyer Perspectives
7.11 The Evolution of the IP Industry
7.12 Intellectual Property
Considerations
7.13 IP Outsourcing
7.14 Making IP Work in the Fabless Semiconductor Community
7.15 IP Acquisition Considerations for
Fabless IC Companies
Chapter 8: e- Commerce
8.1 The Virtual Fab Challenge
8.2 Semiconductor & Fabless Manufacturing: What is Different?
8.3 ?Build to Forecast? for Outsourced Manufacturing
8.4 ERP System Solutions
8.5 The Information Ecosystem: Where Communication is Key
Chapter 9: Quality and Reliability
9.1 General
9.2 Front- End
9.3 Back-End
9.4 Environment, Health and Safety
Chapter 10: Test Development
10.1 Simplifying Outsourced Test Development
10.2 Preparations
10.3 Evaluation
10.4 Conclusion
PART 3 – Becoming a Best-in-Class Fabless
Company
Chapter 11: Best Practices for Fabless Companies
11.1 Achieving Best-in-Class Operations Practices
11.2 A Foundry Manager's
Role in a Fabless Company
11.3 Closing the Loop: Understanding the Manufacturing Flow
11.4 Managing a Virtual Manufacturing Chain
Chapter
12: Building the Right Partnerships
12.1 Suppliers are (Almost) Just as Important as Customers
12.2 Operations in a Fabless Start-Up
12.3 Legal Issues for Fabless Semiconductor Companies
12.4 Semiconductor Back-End Subcontracting: No Longer a Zero-Sum Game
Chapter
13: Building the Right Relationships with the board and VCs
13.1 Creating Successful Corporate Boards in Fabless Companies
13.2 Finding
the Right VC
PART 4- The Fabless Business Model: A Look into the Future
Chapter 14: Perspectives in the Future of Fabless
14.1 Keeping
Up with the Pace of Change in a Fabless World
14.2 Foundry Roadmaps: Partnering, Leading and Innovating
14.3 Semiconductor Manufacturing
in the 21st Century
14.4 The Emerging Dominance of China in the Technology and End Markets
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