By
James J. Licari, AvanTeco, Whittier, CA, USA
James J. Licari, AvanTeco, Whittier, CA, USA
Dale W. Swanson, has over 29 years experience in Materials and process engineering
Dale W. Swanson, has over 29 years experience in Materials and process engineering
Description
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from
theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments,
the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV,
microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures
provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives,
suppliers, and equipment. Each chapter provides comprehensive references.
Included in series
Materials and Processes for Electronic Applications
Audience:
Electronics and materials engineers in the automotive, medical, semiconductors, space, plastics, and military industries.
