Engineering and Technology
Welcome to Elsevier Engineering and Technology journals. We publish more than 130 high quality titles covering key topics, including leading journals such as Computer Methods in Applied Mechanics and Engineering, Building and Environment, Journal of Sound and Vibration, International Journal of Heat and Mass Transfer, Journal of the Mechanics and Physics of Solids, International Journal of Solids and Structures and Automatica. Over 60% of those journals saw their Impact Factor increase in 2012.
From 2013, all Elsevier owned journals offer authors the option to publish via the Open Access model. For more information please visit http://www.elsevier.com/about/open-access/open-access-options
We are also proud to publish many journals on behalf of, or in association with, prestigious Societies, including the International Academy of Astronautics (Acta Astronautica), the International Association for Wind Engineering (Journal of Wind Engineering & Industrial Aerodynamics), and the Society of Manufacturing Engineers (Journal of Manufacturing Systems, Journal of Manufacturing Processes and Manufacturing Letters).
To the authors, reviewers and editors who continue to support the development of Elsevier and partner society Engineering and Technology journals, our sincere thanks for your ongoing contribution.
The journals we publish are constantly developing in terms of aims and scope, editorial processes and online content innovation. Community feedback plays an important role in this process and we welcome comments and suggestions related to existing titles, or ideas for new developments.
Publishing Director – Engineering
Case Studies in … New Open Access Journals Key elements of these new journals include:
Case Studies only: the journal will only accept case studies articles of up to 6 pages
Fast Publication: we are aiming at a publication turnaround from submission to publication of up to three months.
Open Access: articles will be freely available online, upon publication. Authors pay a publication fee after acceptance of their article
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Top 25 Most Downloaded
High temperature long term stability of SiC Schottky diodes • Article
Microelectronics Reliability, Volume 51, Issue 9-11, September 2011, Pages 1778-1782 | Testa, A.; De Caro, S.; Russo, S.; Patti, D.; Torrisi, L.
Synthesis and surface engineering of iron oxide nanoparticles for biomedical applications • Review article
Biomaterials, Volume 26, Issue 18, June 2005, Pages 3995-4021 | Gupta, A.K.; Gupta, M.
Thermomechanical analysis of residual stresses in brazed diamond metal joints using Raman spectroscopy and finite element simulation • Article
Mechanics of Materials, Volume 52, September 2012, Pages 69-77 | Akbari, M.; Buhl, S.; Leinenbach, C.; Spolenak, R.; Wegener, K.
Call for Papers: Computers and Electrical Engineering Special Issue on: On-Chip Parallel and Network-Based Systems
Fri, 18 Jul 2014 10:00:00 GMT
On-chip parallel and network-based systems demand new innovations in all areas of on-chip processor and network design and optimization.
Call for Papers: CFP for SI Emerging Wireless Networks
Wed, 16 Jul 2014 00:00:00 GMT
CFP for CAEE SI Emerging Wireless Networks