Engineering and Technology
Welcome to Elsevier Engineering and Technology journals. We publish more than 130 high quality titles covering key topics, including leading journals such as Computer Methods in Applied Mechanics and Engineering, Building and Environment, Journal of Sound and Vibration, International Journal of Heat and Mass Transfer, Journal of the Mechanics and Physics of Solids, International Journal of Solids and Structures and Automatica. Over 60% of those journals saw their Impact Factor increase in 2012.
From 2013, all Elsevier owned journals offer authors the option to publish via the Open Access model. For more information please visit http://www.elsevier.com/about/open-access/open-access-options
We are also proud to publish many journals on behalf of, or in association with, prestigious Societies, including the International Academy of Astronautics (Acta Astronautica), the International Association for Wind Engineering (Journal of Wind Engineering & Industrial Aerodynamics), and the Society of Manufacturing Engineers (Journal of Manufacturing Systems, Journal of Manufacturing Processes and Manufacturing Letters).
To the authors, reviewers and editors who continue to support the development of Elsevier and partner society Engineering and Technology journals, our sincere thanks for your ongoing contribution.
The journals we publish are constantly developing in terms of aims and scope, editorial processes and online content innovation. Community feedback plays an important role in this process and we welcome comments and suggestions related to existing titles, or ideas for new developments.
Publishing Director – Engineering
Case Studies in … New Open Access Journals Key elements of these new journals include:
Case Studies only: the journal will only accept case studies articles of up to 6 pages
Fast Publication: we are aiming at a publication turnaround from submission to publication of up to three months.
Open Access: articles will be freely available online, upon publication. Authors pay a publication fee after acceptance of their article
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Top 25 Most Downloaded
Clay mineral-enhanced bioremediation of marine oil pollution • Article
Applied Clay Science, Volume 46, Issue 4, December 2009, Pages 337-345 | Warr, L.N.; Perdrial, J.N.; Lett, M.C.; Heinrich-Salmeron, A.; Khodja, M.
High temperature long term stability of SiC Schottky diodes • Article
Microelectronics Reliability, Volume 51, Issue 9-11, September 2011, Pages 1778-1782 | Testa, A.; De Caro, S.; Russo, S.; Patti, D.; Torrisi, L.
The Internet of Things: A survey • Article
Computer Networks, Volume 54, Issue 15, October 2010, Pages 2787-2805 | Atzori, L.; Iera, A.; Morabito, G.
Call for Papers: Special Issue: Artificial Intelligence Techniques in Product Engineering
Wed, 27 Aug 2014 00:00:00 GMT
Rapid changing customer needs in the competitive business environment led to an urgent need of efficient product engineering to support launching successful products. Product engineering concerns the improvement of current products as well as the design and development of new products. There are a number of challenging issues in product engineering, in order to successfully deliver profitable and high quality products to the market. Artificial intelligence techniques could help enterprises to address such challenging issues in the product engineering.
Call for Papers: Call For Papers: Special Issue of Sustainable Cities and Society on Urban Heat Island and Cities of the Future
Wed, 13 Aug 2014 00:00:00 GMT
The aim of this special issue is to summarize the most recent experimental and simulation studies on the observation and mitigation of urban heat Island from both building science and urban climate perspectives. It is also intended to provide awareness about the necessary efforts to mitigate urban heat island in order to enhance indoor/outdoor thermal/wind comfort and to reduce the urban-scale energy consumption in current and future societies. Observational studies, simulation practices (meso and micro scales), economic impacts, and investigations about heat related psychological/health diseases are welcome to submit original full papers.