Editors-in-Chief

  • M.T. Sun

    University of Washington, Seattle, Washington, USA

  • Y. Zeevi

    Technion - Israel Institute of Technology, Haifa, Israel

Editorial Board Members

  • K. Aizawa

    University of Tokyo, Bunkyo-Ku, Japan

  • O. Au

    Hong Kong University of Science & Technology, Kowloon, Hong Kong

  • O. Ben-Shahar

    Ben Gurion University of the Negev, Beer-Sheva, Israel

  • K.L. Chung

    National Taiwan University of Science and Technology, Taipei, Taiwan, ROC

  • P. Eisert

    Fraunhofer Institut für Nachrichtentechnik, Berlin, Germany

  • A. Feuer

    Technion - Israel Institute of Technology, Haifa, Israel

  • Y. He

    Tsinghua University, Beijing, China

  • Z. He

    University of Missouri, Columbia, Missouri, USA

  • C.-S. Kim

    Korea University, Seoul, South Korea

  • J. Kim

    Gwangju Institute of Science & Technology (GIST), Gwangju, South Korea

  • N. Kiryati

    Tel Aviv University, Tel Aviv, Israel

  • R. Koch

    Christian-Albrechts-Universität zu Kiel (CAU), Kiel, Germany

  • C.-C.J. Kuo

    University of Southern California, Los Angeles, California, USA

  • A.F. Laine

    Columbia University, New York, New York, USA

  • H. Li

    University of Electronic Science and Technology of China, Chengdu, China

  • S. Li

    University of Surrey, Guildford, Surrey, UK

  • Y. Li

    IBM Thomas J. Watson Research Center, Hawthorne, New York, USA

  • C.-W. Lin

    National Tsing Hua University, Hsinchu, Taiwan, ROC

  • W. Lin

    Nanyang Technological University, Singapore, Singapore

  • Z. Liu

    Microsoft Research, Redmond, Washington, USA

  • Y. Lu

    Microsoft Research Asia, Beijing, China

  • K.-K Ma

    Nanyang Technological University, Singapore, Singapore

  • S. Ma

    Peking University, Beijing, China

  • G. Marfia

    Università di Bologna, Bologna, Italy

  • C. Micheloni

    Università delgli studi di Udine, Udine, Italy

  • J. Mukhopadhyay

    Indian Institute of Technology, Kharagpur, West Bengal, India

  • N. Ohta

    Sony Corporation, Shinagawa-Ku, Japan

  • S.J. Osher

    University of California at Los Angeles, Los Angeles, California, USA

  • S. Panchanathan

    Arizona State University, Tempe, Arizona, USA

  • G. Qiu

    University of Nottingham, Nottingham, UK

  • S. Rahardja

    Institute for InfoComm Research, Singapore, Singapore

  • M. Roccetti

    Università di Bologna, Bologna, Italy

  • A. Rocha

    Universidade Estadual de Campinas (UNICAMP), Campinas, São Paulo, Brazil

  • G. Sapiro

    University of Minnesota, Minneapolis, USA

  • Y-Q. Shi

    New Jersey Institute of Technology, Newark, New Jersey, USA

  • N.A. Sochen

    Tel Aviv University, Tel Aviv, Israel

  • H. Song

    Pohang University of Science and Technology, Pohang, South Korea

  • D. Tao

    Nanyang Technological University, Singapore, Singapore

  • T.-K. Truong

    I-Shou University, Ta-Hsu-Hsiang, Kaohsiung, Taiwan, ROC

  • G.T.G. Volleberg

    Philips Consumer Electronics, Eindhoven, Netherlands

  • J. Weickert

    Universität des Saarlandes, Saarbrücken, Germany

  • J.-L. Wu

    National Taiwan University, Taipei, Taiwan, ROC

  • D.-N. Yang

    Academia Sinica, Taipei City, Taiwan, ROC

  • C.H. Yeh

    National Sun Yat-Sen University, Taiwan, ROC

  • B. Zeng

    Hong Kong University of Science & Technology, Kowloon, Hong Kong

  • H.V. Zhao

Founding Editors

  • T.R. Hsing

    Bell Communications Research, Morristown, New Jersey, USA

  • Y. Zeevi

    Technion - Israel Institute of Technology, Haifa, Israel

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