RF and mm-Wave Power Generation in Silicon

1st Edition - December 4, 2015
Editors: Hua Wang, Kaushik Sengupta
Language: English
Hardback ISBN:
9 7 8 - 0 - 1 2 - 4 0 8 0 5 2 - 2
eBook ISBN:
9 7 8 - 0 - 1 2 - 4 0 9 5 2 2 - 9

RF and mm-Wave Power Generation in Silicon presents the challenges and solutions of designing power amplifiers at RF and mm-Wave frequencies in a silicon-based process technolog… Read more

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RF and mm-Wave Power Generation in Silicon presents the challenges and solutions of designing power amplifiers at RF and mm-Wave frequencies in a silicon-based process technology. It covers practical power amplifier design methodologies, energy- and spectrum-efficient power amplifier design examples in the RF frequency for cellular and wireless connectivity applications, and power amplifier and power generation designs for enabling new communication and sensing applications in the mm-Wave and THz frequencies.

With this book you will learn:

Power amplifier design fundamentals and methodologies

Latest advances in silicon-based RF power amplifier architectures and designs and their integration in wireless communication systems

State-of-the-art mm-Wave/THz power amplifier and power generation circuits and systems in silicon

Chapter 1. Introduction

1.1 What Are the Key PA Performance Metrics?
1.2 Unique Advantages of Silicon-Based PAs
1.3 Silicon-Based mm-Wave and THz Signal Generationâ€”A New Frontier
References

Part I: Power amplifier design methodologies

Chapter 2. Power amplifier fundamentals

Abstract
2.1 Power Generation and Power Matching
2.2 Classical Linear Power Amplifiers: Classes A, AB, B, and C
2.3 Linear Power Amplifier
2.4 Switching Power Amplifier
2.5 Class E Amplifier
Reference
Further Reading

Part II: RF Power Amplifier Design Examples

Chapter 3. CMOS power amplifier design for wireless connectivity applications: A highly linear WLAN power amplifier in advanced SoC CMOS

Abstract
3.1 Introduction
3.2 Design Considerations of Class-AB PA for WLAN
3.3 Circuit Architecture and Layout Structure
3.4 Shielded Concentric Transformers
3.5 Circuit Implementations
3.6 Measured Results of Experimental Design in Low-Resistivity Wafer
3.7 Improved Design and Measurement Results in Regular Wafer
3.8 PA Integration for SoC
3.9 Performance Summaries and Comparison of State of the Art
3.10 Conclusions
Acknowledgments
References

Chapter 4. CMOS power amplifier design for cellular applications: An EDGE/GSM dual-mode quad-band PA in 0.18Â Âµm CMOS

Abstract
4.1 Introduction
4.2 Standards for Cellular RF Systems
4.3 Adaptive Biasing
4.4 Linearization for Nonlinear C_gd
4.5 Dual-Mode PA
4.6 Measurements of PA
4.7 Conclusion
References

Chapter 5. Energy-efficiency enhancement and linear amplifications: A transformer-based Doherty approach

Abstract
5.1 Introduction
5.2 Optimization of SCT Transformer-Based Doherty Power Amplifiers
5.3 Implementation of SCT Transformer-Based Doherty Power Amplifier for WLAN Applications
5.4 Measurement Results
5.5 Conclusion
References

Chapter 6. Linear power amplification with high back-off efficiency: An out-phasing approach

Abstract
6.1 Introduction
6.2 System Impact from Impairments of Outphasing Design
6.3 Outphasing Topologies
6.4 Linearity Analysis of Outphasing System Using Class-D and Class-F PA
6.5 Back-Off Efficiency Enhancement in Outphasing
6.6 Implementation Examples and Considerations
6.7 Conclusion
References

Chapter 7. Energy efficiency enhancement and linear amplifications: An envelope-tracking (ET) approach

Abstract
7.1 Introduction
7.2 Pseudo-Differential SiGe PA Design
7.3 Envelope-Shaping Analysis for the ET-PA System
7.4 Integrated CMOS EM IC Design
7.5 ET-PA Measurement Results with the EM IC
7.6 Conclusion
Acknowledgments
References

Chapter 8. A digital RF power amplification technique based on the switched-capacitor circuit

Abstract
8.1 Introduction
8.2 Polar and Digital Power Amplifiers
8.3 Theory of Operation
8.4 SCPA Prototype Implementation and Experimental Results
8.5 Extended SCPA Architectures
8.6 Conclusions
References

Chapter 9. A transformer-based reconfigurable digital polar Doherty power amplifier fully integrated in bulk CMOS

Abstract
9.1 Introduction
9.2 Digital Polar Doherty PA Architecture
9.3 Passive Network Designs in the Fully Integrated Doherty PA
9.4 Experimental Results
9.5 Conclusions
References

Part III: mm-Wave and Terahertz Power Generation Design Examples

Chapter 10. 60Â GHz all silicon radio IC: How it all started

Abstract
10.1 Introduction
10.2 Power Amplifier Design
10.3 Power Amplifier Integration into a Single-Chip Radio Transceiver
Acknowledgments
References

Chapter 11. mm-Wave power-combining architectures: Current combining

Abstract
11.1 Introduction
11.2 Two-Way Current-Combining PA
11.3 Measurement Results
11.4 Conclusion
Acknowledgments
References

Chapter 12. mm-Wave power-combining architectures: Hybrid combining

Abstract
12.1 Why mm-Wave, and Why Silicon
12.2 Power-combining techniques
12.3 Design of CMOS Transformer-Based Power-Combining PA
12.4 Experimental Results
12.5 Summary
Acknowledgment
References

Chapter 13. mm-Wave CMOS design above 60Â GHz

Abstract
13.1 Introduction
13.2 NMOS Device performance at mm-Wave Frequencies
13.3 Impedance Matching
13.4 mm-Wave Integrated Circuits
References

Chapter 14. Self-healing techniques for robust mm-Wave power amplification

Abstract
14.1 Introduction
14.2 Power Amplification with Reconfigurability
14.3 mm-Wave power amplification with self-healing capability
14.4 Measurement results
14.5 Conclusion
Acknowledgment
References

Chapter 15. mm-Wave class-E PA design in CMOS

Abstract
15.1 Introduction
15.2 Design Background: Theory of Operation and Starting Design Equations
15.3 Circuit Implementation in 32-nm SOI CMOS
15.4 Measurement and Results
Acknowledgment
References

Chapter 16. High-speed, efficient, mm-Wave power-mixer-based digital transmitters

Abstract
16.1 Introduction
16.2 System architecture
16.3 Design and implementation
16.4 Chip implementation and measurement results
16.5 Conclusions
References

Chapter 17. THz power generation beyond transistor f_max

Abstract
17.1 Multiple-push oscillators
17.2 Sub-terahertz CMOS Push-Push Oscillator
17.3 Quadruple-Push Oscillator in CMOS
17.4 Summary
References

Chapter 18. THz signal generation, radiation, and beam-forming in silicon: A circuit and electromagnetics co-design approach

Abstract
18.1 Motivations for THz
18.2 Current THz technology
18.3 Power generation above f_max
18.4 Inverse Design Approach: Design Evolution of Distributed Active Radiator (DAR)
18.5 Design and optimization of DAR
18.6 Distributed Active Radiator Beam-Scanning Architecture at 0.28Â THz
18.7 Transmitter circuit blocks
18.8 Measurement results
18.9 Conclusions
References

Chapter 19. Silicon-based THz signal generation with multiphase subharmonic injection-locking oscillators

Abstract
19.1 Introduction
19.2 Multiphase IL technique
19.3 A Scalable and Cascadable Active Frequency Multiplier Architecture for THz Signal Generation
19.4 Design of Silicon-Based 500-GHz Signal Generation System
19.5 Measurement Results
19.6 Conclusion
References

Hua Wang

Hua Wang Hua Wang (M’05‒SM’15) received his B.S. degree from Tsinghua University, Beijing, China, in 2003, and M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology, Pasadena, in 2007 and 2009, respectively.

He was with Guidant Corporation during the summer of 2004, working on accelerometer-based posture monitoring systems for implantable biomedical devices. In 2010, he joined Intel Corporation, where he worked on the next generation energy-efficient mm-wave communication link and broadband CMOS Front-End-Module for Wi-Fi systems. In 2011, he joined Skyworks Solutions. His work at Skyworks included the development of SAW-less integrated filter solutions for low-cost cellular-standard Front-End-Module. In 2012, he joined the School of Electrical and Computer Engineering at Georgia Institute of Technology as an assistant professor. He currently holds the Demetrius T. Paris Junior Professorship of the School of Electrical and Computer Engineering. He is generally interested in innovating mixed-signal, RF, and mm-Wave integrated circuits and systems for communication, radar, and bioelectronics applications.

Dr. Wang received National Science Foundation (NSF) CAREER Award in 2015, Roger P. Webb ECE Outstanding Junior Faculty Member Award in 2015, and Lockheed Martin Dean’s Excellence in Teaching Award in 2015. He was the award recipient of the 46th IEEE DAC/ISSCC Student Design Contest Winner in 2009 based on his work of “An Ultrasensitive CMOS Magnetic Biosensor Array for Point-Of-Care (POC) Microarray Application.” He was also a co-recipient of the IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Best Student Paper Award (1st Place) as the students’ Ph.D. advisor in 2014.

Dr. Wang is an Associate Editor of the IEEE Microwave and Wireless Components Letters (MWCL). He is currently a Technical Program Committee (TPC) Member for IEEE Radio Frequency Integrated Circuits Symposium (RFIC), IEEE Custom Integrated Circuits Conference (CICC), IEEE Biopolar/BiCMOS Circuits and Technology Meeting (BCTM), and IEEE/CAS-EMB Biomedical Circuits and Systems Conference (BioCAS). He serves as the Chair of the Atlanta’s IEEE CAS/SSCS joint chapter, which won the IEEE SSCS Outstanding Chapter Award in 2014.

Affiliations and expertise

Assistant Professor, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

Kaushik Sengupta

Kaushik Sengupta Kaushik Sengupta (M’12) received the B.Tech. and M.Tech. degrees in electronics and electrical communication engineering from the Indian Institute of Technology (IIT), Kharagpur, India, both in 2007, and the M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology, Pasadena, CA, USA, in 2008 and 2012, respectively. In February 2013, he joined the faculty of the Department of Electrical Engineering, Princeton University, Princeton, NJ, USA. During his undergraduate studies, in the summers of 2005 and 2006, he performed research at the University of Southern California and the Massachusetts Institute of Technology (MIT), where he was involved with nonlinear integrated systems for high-purity signal generation and low-power RF identification (RFID) tags, respectively. His research interests are in the areas of high-frequency integrated circuits (ICs), electromagnetics, optics for various applications in sensing, imaging, and high-speed communication.

Dr. Sengupta was the recipient of the IBM Ph.D. fellowship (2011–2012), the IEEE Solid-State Circuits Society Predoctoral Achievement Award (2012), the IEEE Microwave Theory and Techniques Graduate Fellowship (2012), and the Analog Devices Outstanding Student Designer Award (2011). He was the recipient of the Charles Wilts Prize in 2013 from Electrical Engineering, Caltech for outstanding independent research in electrical engineering leading to a PhD. He was also the recipient of the Prime Minister Gold Medal Award of IIT (2007), the Caltech Institute Fellowship, the Most Innovative Student Project Award of the Indian National Academy of Engineering (2007), and the IEEE Microwave Theory and Techniques Undergraduate Fellowship (2006). He serves on the Technical Program Committee of the European Solid-State Circuits Conference (ESSCIRC). He was selected in “Princeton Engineering Commendation List for Outstanding Teaching” in 2014. He was the co-recipient of the IEEE RFIC Symposium Best Student Paper Award in 2012 and 2015 IEEE Microwave Theory and Techniques Society (IEEE MTT-S) Microwave Prize.

Affiliations and expertise

Assistant Professor of Electrical Engineering, Princeton University, Princeton, NJ, USA