Reliability and Failure of Electronic Materials and Devices

By

  • Milton Ohring, Stevens Institute of Technology, Hoboken, NJ (Retired)
  • Lucian Kasprzak, Siemens Healthcare Diagnostics (Retired)

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
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Audience

Professional Materials Engineers working with materials used in electronic devices, including silicon chips; Electronics Engineers; Electrical Engineers; Manufacturing Engineers; Chemical Engineers

 

Book information

  • Published: October 2014
  • Imprint: ACADEMIC PRESS
  • ISBN: 978-0-12-088574-9


Table of Contents

CH 1 An Overview of Electronic Devices and Their Reliability
CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
CH 3 Defects, Contamination and Yield
CH 4 The Mathematics of Failure and Reliability
CH 5 Mass Transport-Induced Failure
Ch 6 Electronic Charge-Induced Damage
CH 7 Environmental Damage to Electronic Products
CH 8 Packaging Materials, Processes, and Stresses
CH 9 Degradation of Contacts and Packages
CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices
CH 11 Characterization and Failure Analysis of Material, Devices and Packages
CH 12 Future Directions and Reliability Issues