Reliability and Failure of Electronic Materials and Devices book cover

Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

Audience
Professional Materials Engineers working with materials used in electronic devices, including silicon chips; Electronics Engineers; Electrical Engineers; Manufacturing Engineers; Chemical Engineers

Hardbound, 758 Pages

Published: October 2014

Imprint: Academic Press

ISBN: 978-0-12-088574-9

Contents

  • CH 1 An Overview of Electronic Devices and Their Reliability
    CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
    CH 3 Defects, Contamination and Yield
    CH 4 The Mathematics of Failure and Reliability
    CH 5 Mass Transport-Induced Failure
    Ch 6 Electronic Charge-Induced Damage
    CH 7 Environmental Damage to Electronic Products
    CH 8 Packaging Materials, Processes, and Stresses
    CH 9 Degradation of Contacts and Packages
    CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices
    CH 11 Characterization and Failure Analysis of Material, Devices and Packages
    CH 12 Future Directions and Reliability Issues

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