PVD for Microelectronics: Sputter Desposition to Semiconductor Manufacturing

Series Editor:

  • Stephen Rossnagel, IBM Corporation, T.J. Watson Research Center, Yorktown Heights, New York, U.S.A.
  • Ronald Powell, Novellus Systems, Inc., Palo Alto, California
  • Abraham Ulman, Polytechnic University, Brooklyn, New York, U.S.A.

GENERAL DESCRIPTION OF THE SERIESPhysics of Thin Films is one of the longest running continuing series in thin film science, consisting of 25 volumes since 1963. The series contains quality studies of the properties of various thin films materials and systems.In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.GENERAL DESCRIPTION OF THE VOLUMEThis volume, part of the Thin Films Series, has been wholly written by two authors instead of showcasing several edited manuscripts.
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Thin film and surface science researchers in chemistry, materials science, electrical engineering, biology, and condensed matter physics.


Book information

  • Published: October 1998
  • ISBN: 978-0-12-533026-8

Table of Contents

Useful Conversion Factors and Constants. Introduction. Physics of Sputtering. Plasma Systems. The Planar Magnetron. Sputtering Tools. Directional Deposition. Planarized PVD: Use of Elevated Temperature and/or High Pressure. Ionized Magnetron Sputter Deposition. PVD Materials and Processes. Process Modeling for Magnetron Deposition. Sputtering Targets. Index.