Hybrid Microcircuit Technology Handbook, 2nd Edition

Materials, Processes, Design, Testing and Production


  • James J. Licari, AvanTeco, Whittier, CA, USA

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
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Materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.


Book information

  • Published: December 1998
  • ISBN: 978-0-8155-1423-7

Table of Contents

1. Introduction 1.0 Classification of Materials for Microelectronics 2.0 Classification of Processes 3.0 Definition and Characteristics of Hybrid Circuits 4.0 Applications References2. Substrates 1.0 Functions 2.0 Surface Characteristics 3.0 Alumina Substrates 4.0 Beryllia Substrates 5.0 Aluminum Nitride 6.0 Metal Matrix Composites 7.0 Ceramic Substrate Manufacture 8.0 Enameled Metal Substrates 9.0 Quality Assurance and Test Methods References3. Thin Film Processes 1.0 Deposition Processes 2.0 Thin Film Resistor Processes 3.0 Photoresist Materials and Processes 4.0 Etching Materials and Processes 5.0 Thin-Film Microbridge Crossover Circuits References4. Thick Film Processes 1.0 Fabrication Processes 2.0 Direct Writing 3.0 Paste Materials 4.0 Non-Noble-Metal Thick Films 5.0 Polymer Thick Films References5. Resistor Trimming 1.0 Laser Trimming 2.0 Abrasive Trimming 3.0 Resistor Probing/Measurement Techniques 4.0 Types of Resistor Trims 5.0 Special Requirements References6. Parts Selection 1.0 General Considerations 2.0 Packages 3.0 Active Devices 4.0 Passive Devices References7. Assembly Processes 1.0 Introduction 2.0 Die and Substrate Attachment 3.0 Interconnections 4.0 Cleaning 5.0 Particle Immobilizing Coatings 6.0 Vacuum-Baking and Sealing References8. Testing 1.0 Electrical Testing 2.0 Visual Inspection 3.0 Nondestructive Screen Tests 4.0 Destructive Screen Tests References9. Handling and Clean Rooms 1.0 Handling of Hybrid Circuits and Components 2.0 Electrostatic Discharge References10. Design Guidelines 1.0 Hybrid Microcircuit Design Transmittal 2.0 System Requirements Affecting Hybrid Circuit Design 3.0 Material and Process Selection 4.0 Quality Assurance Provisions 5.0 Hybrid Design Process 6.0 Substrate Parasitics 7.0 Thermal Considerations 8.0 Layout Guidelines Common to Both Thick- and Thin-Film Hybrids 9.0 Guide to High-Performance Hybrid/MCM/Package Design 10.0 Equations 11.0 Cross-Talk 12.0 Signal Line Capacitance 13.0 Signal-Line Inductance 14.0 Microstrip Propagation Delay 15.0 Typical Material Thicknesses 16.0 Thick-Film Materials and Processes Description 17.0 Thick-Film Design Guidelines 18.0 Thin-Film Guidelines References11. Documentation and Specifications 1.0 Documentation 2.0 Military and Government Specifications References12. Failure Analysis 1.0 Types and Causes of Hybrid Failures 2.0 Failure Analysis Techniques 3.0 Analytical Techniques 4.0 Causes of Hybrid Circuit Failures 5.0 Case Histories of Hybrid Circuit Failures References13. Multichip Modules: A New Breed of Hybrid Microcircuits 1.0 Applications 2.0 Interconnect Substrate Designs and Fabrication Methods 3.0 Assembly Methods 4.0 Testing and Testability 5.0 Issues References Index