High-Performance Embedded Computing book cover

High-Performance Embedded Computing

Applications in Cyber-Physical Systems and Mobile Computing

High-Performance Embedded Computing, Second Edition, combines leading-edge research with practical guidance in a variety of embedded computing topics, including real-time systems, computer architecture, and low-power design. Author Marilyn Wolf presents a comprehensive survey of the state of the art, and guides you to achieve high levels of performance from  the embedded systems that bring these technologies together.

The book covers CPU design, operating systems, multiprocessor programs and architectures, and much more. Embedded computing is a key component of cyber-physical systems, which combine physical devices with computational resources for control and communication. This revised edition adds new content and examples of cyber-physical systems throughout the book, including design methodologies, scheduling, and wide-area CPS to illustrate the possibilities of these new systems.

Audience

Professionals in high-performance and /or embedded computing; practitioners in cyber-physical systems, and students in graduate courses on these topics

Paperback, 506 Pages

Published: April 2014

Imprint: Morgan Kaufmann

ISBN: 978-0-12-410511-9

Contents

  • A Historical Perspective
    Chapter 1 A Review of Materials Science
    1.1. Introduction
    1.2. Structure
    1.3. Defects in Solids
    1.4. Bonds and Bands in Materials
    1.5. Thermodynamics of Materials
    1.6. Kinetics
    1.7. Nucleation
    1.8. An Introduction to Mechanical Behavior
    1.9. Conclusion
    Chapter 2 Vacuum Science and Technology
    2.1. Introduction
    2.2. Kinetic Theory of Gases
    2.3. Gas Transport and Pumping
    2.4. Vacuum Pumps
    2.5. Vacuum Systems
    2.6. Conclusion
    Chapter 3 Thin-Film Evaporation Processes
    3.1. Introduction
    3.2. The Physics and Chemistry of Evaporation
    3.3. Film Thickness Uniformity and Purity
    3.4. Evaporation Hardware
    3.5. Evaporation Processes and Applications
    3.6. Conclusion
    Chapter 4 Discharges, Plasmas, and Ion-Surface Interactions
    4.1. Introduction
    4.2. Plasmas, Discharges, and Arcs
    4.3. Fundamentals of Plasma Physics
    4.4. Reactions in Plasmas
    4.5. Physics of Sputtering
    4.6. Ion Bombardment Modification of Growing Films
    4.7. Conclusion
    Chapter 5 Plasma and Ion Beam Processing of Thin Films
    5.1. Introduction
    5.2. DC, AC, and Reactive Sputtering Processes
    5.3. Magnetron Sputtering
    5.4. Plasma Etching
    5.5. Hybrid and Modified PVD Processes
    5.6. Conclusion
    Chapter 6 Chemical Vapor Deposition
    6.1. Introduction
    6.2. Reaction Types
    6.3. Thermodynamics of CVD
    6.4. Gas Transport
    6.5. Film Growth Kinetics
    6.6. Thermal CVD Processes
    6.7. Plasma-Enhanced CVD Processes
    6.8. Some CVD Materials Issues
    6.9. Safety
    6.10. Conclusion
    Chapter 7 Substrate Surfaces and Thin-Film Nucleation
    7.1. Introduction
    7.2. An Atomic View of Substrate Surfaces
    7.3. Thermodynamic Aspects of Nucleation
    7.4. Kinetic Processes in Nucleation and Growth
    7.5. Experimental Studies of Nucleation and Growth
    7.6. Conclusion
    Chapter 8 Epitaxy
    8.1. Introduction
    8.2. Manifestations of Epitaxy
    8.3. Lattice Misfit and Defects in Epitaxial Films
    8.4. Epitaxy of Compound Semiconductors
    8.5. High-Temperature Methods for Depositing Epitaxial Semiconductor Films
    8.6. Low-Temperature Methods for Depositing Epitaxial Semiconductor Films
    8.7. Mechanisms and Characterization of Epitaxial Film Growth
    8.8. Conclusion
    Chapter 9 Film Structure
    9.1. Introduction
    9.2. Structural Morphology of Deposited Films and Coatings
    9.3. Computational Simulations of Film Structure
    9.4. Grain Growth, Texture, and Microstructure Control in Thin Films
    9.5. Constrained Film Structures
    9.6. Amorphous Thin Films
    9.7. Conclusion
    Chapter 10 Characterization of Thin Films and Surfaces
    10.1. Introduction
    10.2. Film Thickness
    10.3. Structural Characterization of Films and Surfaces
    10.4. Chemical Characterization of Surfaces and Films
    10.5. Conclusion
    Chapter 11 Interdiffusion, Reactions, and Transformations in Thin Films
    11.1. Introduction
    11.2. Fundamentals of Diffusion
    11.3. Interdiffusion in Thin Metal Films
    11.4. Compound Formation and Phase Transformations in Thin Films
    11.5. Metal-Semiconductor Reactions
    11.6. Mass Transport in Thin Films under Large Driving Forces
    11.7. Conclusion
    Chapter 12 Mechanical Properties of Thin Films
    12.1. Introduction
    12.2. Mechanical Testing and Strength of Thin Films
    12.3. Analysis of Internal Stress
    12.4. Techniques for Measuring Internal Stress in Films
    12.5. Internal Stresses in Thin Films and Their Causes
    12.6. Mechanical Relaxation Effects in Stressed Films
    12.7. Adhesion
    12.8. Conclusion

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