Hardening Semiconductor Components Against Radiation and Temperature

By

  • William R. Dawes

This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology.
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Audience

Semiconductor manufacturers, engineers, researchers, and management.

 

Book information

  • Published: December 1990
  • Imprint: WILLIAM ANDREW
  • ISBN: 978-0-8155-1212-7


Table of Contents

Interaction of Hazardous Environments with Electronic DevicesHardened Technologies for Hazardous EnvironmentsCircuit Design for Reliable Operations in Hazardous EnvironmentsPackaging, Testing, and Hardness Assurance