Hardening Semiconductor Components Against Radiation and Temperature
By- William R. Dawes
This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology.
Audience
Semiconductor manufacturers, engineers, researchers, and management.
Hardbound, 340 Pages
Published: December 1990
Imprint: William Andrew
ISBN: 978-0-8155-1212-7
Contents
- Interaction of Hazardous Environments with Electronic DevicesHardened Technologies for Hazardous EnvironmentsCircuit Design for Reliable Operations in Hazardous EnvironmentsPackaging, Testing, and Hardness Assurance

