Handbook of Silicon Wafer Cleaning Technology, 2nd EditionEdited by
- Karen Reinhardt
- Werner Kern
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included.
Managers, engineers, and technicians that manufacture integrated circuits or supply the semiconductor and microelectronics industries.
Hardbound, 660 Pages
Published: January 2008
Imprint: William Andrew
- Part 1: Introduction and Overview1. Overview and Evolution of Silicon Wafer Cleaning Technology2. Overview of Wafer Contamination and DefectivityPart 2: Wet-Chemical Processes3. Particle Deposition and Adhesion4. Aqueous Cleaning and Surface Conditioning ProcessesPart 3: Dry Cleaning Processes5. Gas-phase Wafer Cleaning Technology6. Plasma Stripping and Cleaning7. Cryogenic Aerosols and Supercritical Fluid CleaningPart 4: Analytical and Control Aspects8. Detection and Measurement of Particulate Contaminants9. Surface Chemical Composition and Morphology10. Ultratrace Impurity and Surface Morphology Analysis11. Analysis and Control of Electrically Active ContaminantsPart 5: Directions for the Near Future