Handbook of Silicon Based MEMS Materials and Technologies book cover

Handbook of Silicon Based MEMS Materials and Technologies

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.

Key topics covered include:

  • Silicon as MEMS material
  • Material properties and measurement techniques
  • Analytical methods used in materials characterization
  • Modeling in MEMS
  • Measuring MEMS
  • Micromachining technologies in MEMS
  • Encapsulation of MEMS components
  • Emerging process technologies, including ALD and porous silicon

Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.

  • Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.
  • Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
  • Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
  • Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.

Engineers, researchers and scientists in sensor manufacturing.


Published: January 2010

Imprint: William Andrew

ISBN: 978-0-8155-1594-4


  • "This is a comprehensive state-of-the-art guide on MEMS materials and manufacturing for current and future applications. Engineers, materials scientists, and MEMS developers will find this handbook to be an invaluable resource that will not sit on a bookshelf but rather be a well-used reference text used in the development of MEMS devices."--Electrical Insulation

    "Handbook of Silicon Based MEMS Materials and Technologies was published in April 2010. Altogether 73 leading experts from 12 countries participated to the writing process and the result was nearly 700 pages about materials, modeling, measuring, processes and packaging within silicon based MEMS."--MEMS Blog


  • PART I: Silicon as MEMS Material
    Edited by Markku Tilli
    1. Properties of silicon
    2. CZ Growth of silicon crystals
    3. Properties of silicon crystals
    4. Oxygen in Silicon5. Silicon wafers; preparation and properties
    6. Epi wafers; preparation and properties
    7. Thick-Film SOI wafers; preparation and properties
    8. Silicon dioxides

    PART II: Modeling in MEMS
    Edited by Teruaki Motooka and Risto Nieminen
    9. Multiscale modeling methods
    10. Manufacture and processing of MEMS structures
    11. Mechanical properties of silicon microstructures
    12. Electrostatic and RF properties of MEMS structures
    13. Optical Modelling of MEMS
    14. Gas Damping in Vibrating MEMS structures

    PART III: Measuring MEMS
    Edited by Veli-Matti Airaksinen
    15. Introduction to Measuring MEMS
    16. Silicon wafer and thin film measurements
    17. Optical measurement of static and dynamic displacement
    18. MEMS residual stress characterization, methodology and perspective
    19. Strength of bonded interfaces
    20. Focused ion and electron beam techniques
    21.Oxygen and Bulk Microdefects in Silicon

    PART IV: Micromachining Technologies in MEMS
    Edited by Helmut Seidel
    22. MEMS litography
    23. Deep reactive ion etching (DRIE)
    24. Wet etching of silicon
    25. Porous silicon based MEMS
    26. Atomic layer deposition in MEMS technology
    27. Metallic glass
    29. Surface micromachining
    29. Silicon based bioMEMS micromachining technologies

    PART V: Encapsulation of MEMS Components
    Edited by Heikki Kuisma and Ari Lehto
    30. Introduction to encapsulation of MEMS devices
    31. Silicon direct bonding
    32. Anodic bonding
    33. Glass frit bonding
    34. Metallic alloy seal bonding
    35. Bonding CMOS processed wafers
    36. Non-Destructive Bond Strength Testing of Anodic Bonded Wafers
    37. Wafer Bonding Equipment
    38. Encapsulation by Film Deposition
    39. Via Technologies for MEMS40. Outgassing and Gettering
    41. Dicing of MEMS devices42. Hermecity Tests


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