- Glenn O. Mallory
- Juan B. Haber
This book describes the chemical principles of the major electroless processes and the practical applications of these techniques in the industry. Thanks to the coordinated efforts of 26 individual authors - this book fills the void which has existed for a complete reference on electroless deposition.
The electroplating and surface finishing industries.
Hardbound, 538 Pages
Published: December 1990
Imprint: William Andrew
- 1. The Fundamental Aspects of Electroless Nickel Plating The Electroless Nickel Plating Bath: Components2. The Electroless Nickel Plating Bath: Effect of Variables on the Process Electroless Nickel Plating with Hypophosphite Miscellaneous Ions Alkaline Hypophosphite Plating Solutions Plating with Sodium Borohydride Plating with Amine Boranes Influence of Variables on Plating Rate Kinetics of Electroless Nickel Deposition3. Troubleshooting Electroless Nickel Plating Solutions Bath Chemistry Substrate Activation Equipment/Mechanical Needs Contamination of the Solution Conclusion Troubleshooting Guide Electroless Nickel4. The Properties of Electroless Nickel Plating Structure of Electroless Nickel Mechanical Properties of Electroless Nickel Internal Stresses in Electroless Nickel Deposits Physical Properties of Electroless Nickel Wear Properties of Electroless Nickel5. Equipment Design for Electroless Nickel Plating Tank Construction Materials Heating of Electroless Nickel Solutions Energy Conservation Filtration Pump Materials Residual Contamination Sources6. Quality Control of Electroless Nickel Deposits Quality Method Test Methods Post-Treatments Quality Control7. Surface Preparation for Electroless Nickel Plating Iron and Ferrous Alloys Aluminum and Aluminum Alloys Copper and Copper Alloys Magnesium Beryllium Titanium Zinc Molybdenum and Tungsten Nonmetallic Substrates Masking8. Engineering Applications of Electroless Nickel Aerospace Applications Automotive Applications Applications in the Chemical Processing Industry Oil and Gas Production Food Processing Industry Mining and Materials Handling Applications Military Applications Miscellaneous Applications9. Electroless Nickel Applications in Electronics Electronic Components and Packages Fine Line Patterning of Ceramic Substrates for Electronics Selection of a Patterning System Plating Circular Connectors with Electroless Nickel Electroless Nickel Specifications Plating Procedures and Processes Electroless Nickel for Memory Disks10. Electroless Deposition of Alloys Electroless Nickel-Phosphorus and Nickel-Boron Based Alloys Electroless Cobalt-Phosphorus Based Alloys Electroless Copper Based Alloys Electroless Palladium-Phosphorus Alloys11. Composite Electroless Plating Wear Resistance Friction Coefficient Surface Finishing Particle-Solution Interactions12. Fundamental Aspects of Electroless Copper Plating Composition of Electroless Copper Plating Solutions The Mixed Potential Theory Application of the Mixed Potential Theory Partial Reactions Kinetics of Electroless Copper Deposition Catalysts for Electroless Copper Plating Properties of Electroless Copper Deposits13. Electroless Copper in Printed Wiring Board Fabrication Subtractive Processing The Electroless Copper Process Additive Processing Alternative Processes Summary14. Plating on Plastics Cleaners Predips Etchants Neutralizers Preactivators Activators Accelerators Electroless Plating Electromagnetic Interference Shielding15. Electroless Plating of Gold and Gold Alloys Pure Gold Gold Alloys Applications16. Electroless Plating of Platinum Group Metals Pure Palladium, Palladium-Phosphorus, and Palladium-Boron Palladium Alloys Pure Platinum Platinum Alloys Ruthenium Rhodium Concluding Remarks17. Electroless Plating of Silver Plating Process and the Reaction Mechanism Plated Film Practice of Electroless Silver Plating18. Electroless Cobalt and Cobalt Alloys Section 1. Properties of Electroless Cobalt Section 2. Progress in the Process of Electroless Cobalt19. Chemical Deposition of Metallic Films from Aqueous Solutions Autocatalytic (Electroless) Plating Displacement (Immersion) Plating Contact Plating20. Waste Treatment for Electroless Plating Waste Minimization Conventional Treatment Technology Advanced Treatment TechnologyIndex