Electroless Copper and Nickel-Phosphorus Plating
Processing, Characterisation and Modelling
- W Sha, Materials science; Metallurgy: Queen's University Belfast
- Xiaomin Wu, Materials innovation institute, Delft, The Netherlands
- K G Keong, formerly Queen's University Belfast, UK
After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.
Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.
Researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics, and aerospace industries
- Published: January 2011
- Imprint: Woodhead Publishing
- ISBN: 978-1-84569-808-9
The author's use of modelling brings a new level of fundamental understanding to the field., Materials World