Electroless Copper and Nickel-Phosphorus Plating book cover

Electroless Copper and Nickel-Phosphorus Plating

Processing, Characterisation and Modelling

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.

After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.

Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

Hardbound, 304 Pages

Published: January 2011

Imprint: Woodhead Publishing

ISBN: 978-1-84569-808-9

Reviews

  • The author's use of modelling brings a new level of fundamental understanding to the field., Materials World

Contents

  • Introduction to electroless copper and nickel-phosphorus (Ni-P) depositions. Part 1 Electroless copper depositions: Surface morphology evolution of electroless copper deposits; Cross-section of electroless copper deposits and the void fraction; Crystal structure and surface residual stress of electroless copper deposits; The atomic model of the diamond pyramid structure in electroless copper deposits; Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits; Adhesion strength of electroless copper deposit to epoxy board; Electrical resistivity of electroless copper deposit; Applications of electroless copper deposits. Part 2 Electroless nickel-phosphorus (Ni-P) depositions: Crystallisation of nickel-phosphorus (Ni-P) deposits with high phosphorus content; Crystallisation of nickel-phosphorus (Ni-P) deposits with medium and low phosphorus content; Modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits; Artificial neural network (ANN) modelling of crystallisation temperatures of nickel-phosphorus deposits; Hardness evolution of nickel-phosphorus (Ni-P) deposits with thermal processing; Applications of electroless nickel-phosphorus (Ni-P) plating.

Advertisement

advert image