Ceramic Thick Films for MEMS and Microdevices book cover

Ceramic Thick Films for MEMS and Microdevices

The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications – forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads.  Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.

Audience

Engineers working in the semiconductor / MEMS industry – in design, manufacturing and R&D functions; Engineers in industry sectors using MEMS devices, from automotive / aerospace to biosensors / medicine; Researchers and graduate students in academic institutions.

Hardbound, 192 Pages

Published: October 2011

Imprint: William Andrew

ISBN: 978-1-4377-7817-5

Contents

  • Integration and applications

    Routes to thick films

    Thick film deposition techniques

    Microstructure-property relationships

    Pattering and structuring

    Houston, we have a problem: Thick film troubleshooting

    Recipes and techniques

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