Advances in Research and Development: Modeling of Film Deposition for Microelectronic Applications, 22

Modeling of Film Deposition for Microelectronic Applications

  • Ronald Powell, Novellus Systems, Inc., Palo Alto, California
    • Abraham Ulman, Polytechnic University, Brooklyn, New York
      • John Vossen, RCA Laboratories, Princeton, New Jersey
        • Maurice Francombe, Georgia State University, Atlanta, U.S.A.

        Audience

        Researchers in thin films; AVS; microelectronics and computer simulation in this field.

 

Book information

  • Published: October 1996
  • Imprint: ACADEMIC PRESS
  • ISBN: 978-0-12-533022-0


Table of Contents

M.J. Brett, S.K. Dew, and T.J. Smy, Thin Film Microstructure and Process Simulation Using SIMBAD. S. Hamaguchi, Mathematical Methods for Thin Films Deposition Simulations. C.-C. Fang, V. Prasad, R.V. Joshi, F. Jones, and J.J. Hsieh, A Process Model for Sputter-Deposition of Thin Films Using Molecular Dynamics. T.S. Cale and V. Mahadev, Feature Scale Transport and Reaction during Low Pressure. Chapter References. Author Index. Subject Index.