Adhesives Technology for Electronic Applications

Materials, Processing, Reliability


  • James J. Licari, AvanTeco, Whittier, CA, USA
  • James J. Licari, AvanTeco, Whittier, CA, USA
  • Dale W. Swanson, has over 29 years experience in Materials and process engineering
  • Dale W. Swanson, has over 29 years experience in Materials and process engineering

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.
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Electronics and materials engineers in the automotive, medical, semiconductors, space, plastics, and military industries.


Book information

  • Published: August 2005
  • ISBN: 978-0-8155-1513-5


"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both." - George Riley

Table of Contents

1. Introduction1.1 Adhesives Types and Definitions1.2 Summary of Packaging Technologies1.3 History of Adhesives in Electronic Applications1.4 Comparison of Polymer Adhesives with Metallurgical and Vitreous Attachment Materials1.5 Specifications1.6 The Market 2. Functions and Theory of Adhesives2.1 Mechanical Attachment2.2 Electrical Connections2.3 Thermal Dissipation2.4 Stress Dissipation 3. Chemistry, Formulation, and Properties of Adhesives3.1 Chemistry3.2 Formulation of Adhesives3.3 Properties 4. Adhesive Bonding Properties4.1 Cleaning4.2 Surface Treatments4.3 Adhesive Dispensing4.4 Placement of Devices and Components4.5 Curing4.6 Rework 5. Applications5.1 General Applications5.2 Specific Applications 6. Reliability6.1 Failure Modes and Mechanisms6.2 Specifications 7. Test and Inspection Methods7.1 Physical Tests7.2 Electrical Tests7.3 Environmental Tests7.4 Thermal Tests7.5 Mechanical and Thermomechanical Tests7.6 Chemical AnalysisAppendixConversion FactorsAbbreviations and AcronymsIndex